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D10 Datasheet PDF Download - STMicroelectronics

Номер произв D10
Описание Memory Micromodules General Information for D1/ D2 and C Packaging
Производители STMicroelectronics
логотип STMicroelectronics логотип 
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D10 Даташит, Описание, Даташиты
D10, D15, D20, D22, C20, C30
MICROMODULES
Memory Micromodules
General Information for D1, D2 and C Packaging
s Micromodules were developed specifically for
embedding in Smartcards and Memory Cards
s The Micromodule provides:
– Support for the chip
– Electrical contacts
– Suitable embedding interface for gluing the
module to the plastic package
s Physical dimensions and contact positions
compliant to the ISO 7816 standard
s Micromodules delivered as a continuous Super
35 mm tape. (This differs from the standard
35 mm tape in the spacing distance between
the indexing holes.)
DESCRIPTION
Memory Cards consist of two main parts: the
plastic card, and the embedded Micromodule
(which, in turn, carries the silicon chip).
The plastic card is made of PVC, ABS or similar
material, and can be over-printed with graphics,
text, and magnetic strips. The Micromodule is
embedded in a cavity in the plastic card.
The Micromodules are mounted on Super 35 mm
metallized epoxy tape, and are delivered on reels.
These contain all of the chips from a number of
wafers, including those chips that were found to be
non-functioning during testing. Traceability is
ensured by a label fixed on the reel.
potting side
contact side
D15
D10
D20
D22
C30 C20
Table 1. Memory Card and Memory Tag Integrated Circuits
Modul e
Please see the data briefing sheets of these products for example illustrations of these
micromodule s
D10 ST1200, ST1305B, ST1331, ST1333, ST1335, ST1336, ST1353, ST1355
D15 ST14C02, ST1305B, ST1335, ST1336, ST1355
D20 ST14C02, M14C04, M14C16, M14C32
D22 M14C64, M14128, M14256
C30 M35101, M35102
C20 M35101, M35102
December 1999
1/13
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D10 Даташит, Описание, Даташиты
MICROMODULES
Table 2. Memory Card Products
Type
Description (please see the individual product data
sheets for full specifications)
ST14C02C Memory Card IC, 2 Kbit (256 x 8) Serial I2C Bus EEPROM
M14C04 Memory Card IC, 4 Kbit Serial I2C Bus EEPROM
M14C16 Memory Card IC, 16 Kbit Serial I2C Bus EEPROM
M14C32 Memory Card IC, 32 Kbit Serial I2C Bus EEPROM
M14C64 Memory Card IC, 64 Kbit Serial I2C Bus EEPROM
M14128
Memory Card IC, 128 Kbit Serial I2C Bus EEPROM
M14256
Memory Card IC, 256 Kbit Serial I2C Bus EEPROM
ST1200
Memory Card IC, 256 bit OTP EPROM with Lock-Out
ST1305B
Memory Card IC, 192 bit High Endurance EEPROM
with Secure Logic Access Control
ST1331
ST1333
ST1335
Memory Card IC, 272 bit High Endurance EEPROM
with Advanced Security Mechanisms
ST1336
M35101 Contactless Memory Chip, 13.56 MHz, 2048 bit EEPROM
M35102
Contactless Memory Chip with 64-bit Unique ID,
13.56 MHz, 2048 bit EEPROM
Process Technology Module Style
1.2 µm
0.6 µm
0.6 µm
0.6 µm
0.6 µm
0.6 µm
0.6 µm
3.5 µm
1.5 µm
CMOS
CMOS
CMOS
CMOS
CMOS
CMOS
CMOS
NMOS
CMOS
D15, D20
D20
D20
D20
D22
D22
D22
D10
D10, D15
1.2 µm
1.2 µm
1.2 µm
1.2 µm
0.6 µm
CMOS
CMOS
CMOS
CMOS
CMOS
D10
D10
D10, D15
D10, D15
C20, C30
0.6 µm
CMOS
C20, C30
The assembly flows is as follows:
1. Dice sawing
2. Dice attach
3. Wire bonding
4. Potting
5. Milling (depending on product)
The range of products and types of Micromodule
are summarized in Table 1 and Table 2. For large
volumes, ST is able to offer customized module
tape.
DELIVERY
The Super 35mm metallized epoxy tape is
delivered on reels, as shown in Figure 1. These
contain all of the chips from a number of wafers,
including those chips that were found to be non-
functioning during testing. Traceability is ensured
by a label fixed on the reel.
The typical quantity is 10,000 modules per reel,
with priority given to lot integrity on the reel. The
maximum quantity is 15,000 per reel.
Parts which are faulty (mechanically or electrically
defective) are identified by punch holes. The
specification for the reject punch holes is shown in
Figure 4 for the D10 micromodule, in Figure 5 for
the D15 micromodule, in Figure 6 for the D20
micromodule, and in Figure 7 for the D22
micromodule.
Tape joins (tape splicing) are never more than 10
per 10 metre length, as shown in Figure 2 and
Figure 3.
At least 2.1 m of leader, and 2.1 m of trailer is
included on each reel. Each is made of PVC Super
35 mm tape, without metalisation, and is opaque
to infrared and white light.
A “failure” marking of reject holes is included at the
beginning and end of the tape of a minimum of 5
consecutive module pitches (double positions).
Modules should be stored within the temperature
range -40 °C to + 85 °C, for no more than 1 year.
Each reel is packed in an antistatic bag, along with
a desiccant bag, and a humidity indicator card.
This card indicates the level of humidity as follows:
30 - Blue: protection assured
40 - Pink: renew the desiccant bag
50 - Pink: protection no longer ensured
Three self adhesive plastic identification labels are
attached: one to the reel, one to the antistatic bag,
2/13
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D10 Даташит, Описание, Даташиты
MICROMODULES
Table 3. Manufacturing Flow and Manufacturing Facility Locations
Operation
Location and Facility
Wafer Diffusion
Rousset, France. 6” wafer fab.
Agrate, Italy. 6” wafer fab.: standard EEPROM only
Electrical Wafer Test
Rousset, France.
Agrate, Italy: standard EEPROM only
Assembly
Casablanca, Morocco.
Final Test
Rousset, France.
Casablanca, Morocco.
Table 4. Material Specification
Material
Description
Tape
Basic material
MCTS T2 or IBIDEN rough, typical thickness 120 µm
Adhesive
Modified epoxy, typical thickness 18 µm
Laminated copper foil
Typical thickness 35 µm
Adhesive strength
> 0.8 N/mm at room temperature. Monitored by the tape manufacturer using
appropriate test methods
Tape Surface
The whole epoxy adhesive surface is controlled to be free of dirt, grease, cleaning
compounds and parting compounds
Surface roughness
Typically Rz: 3-12 µm at first accepted delivery
Contact surface
Nickel-gold, galvanised treatment
Nickel thickness
2 µm (min.)
Gold thickness
contact side, 0.1 µm (min.)
Total tape thickness
160 ± 30 µm
Control, Palmer
“Special flat” diameter 3 mm, F = 1.5 N
Chip Interconnect
Dice bonding
Silver epoxy
Bonding wire
Gold 25 µm
Ring (D22 only)
Bronze
Protective coating
Material
UV epoxy, Black epoxy
Assembly
Casablanca, Morocco.
3/13
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