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PDF HMC1118 Data sheet ( Hoja de datos )
| Número de pieza | HMC1118 | |
| Descripción | Nonrefective Switch | |
| Fabricantes | Analog Devices | |
| Logotipo |  |
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High Isolation, Silicon SPDT,
Nonrefective Switch, 9 kHz to 13.0 GHz
HMC1118
FEATURES
Nonreflective 50 Ω design
Positive control: 0 V/3.3 V
Low insertion loss: 0.68 dB at 8.0 GHz
High isolation: 48 dB at 8.0 GHz
High power handling
35 dBm through path
27 dBm terminated path
High linearity
1 dB compression (P1dB): 37 dBm typical
Input third-order intercept (IIP3): 62 dBm typical
ESD rating: 2 kV human body model (HBM)
3 mm × 3 mm, 16-lead LFCSP package
No low frequency spurious
Settling time (0.05 dB margin of final RFOUT): 7.5 μs
APPLICATIONS
Test instrumentation
Microwave radios and very small aperture terminals (VSATs)
Military radios, radars, and electronic counter measures (ECMs)
Fiber optics and broadband telecommunications
FUNCTIONAL BLOCK DIAGRAM
GND 1 HMC1118
GND 2
RFC 3
GND 4
50Ω 12 VDD
11 LS
50Ω
10 VCTRL
9 VSS
Figure 1.
PACKAGE
BASE
GND
GENERAL DESCRIPTION
The HMC1118 is a general-purpose, broadband, nonreflective
single-pole, double-throw (SPDT) switch in a LFCSP surface
mount package. Covering the 9 kHz to 13.0 GHz range, the
switch offers high isolation and low insertion loss. The switch
features >48 dB isolation, 0.68 dB insertion loss up to 8.0 GHz,
and a 7.5 μs settling time of 0.05 dB margin of final RFOUT. The
switch operates using positive control voltage logic lines of +3.3 V
and 0 V and requires +3.3 V and −2.5 V supplies. The HMC1118
can cover the same operating frequency range with a single
positive supply voltage applied and the negative supply voltage
(VSS) tied to ground and still maintaining good power handling
performance. The HMC1118 is packaged in a 3 mm × 3 mm,
surface mount LFCSP package.
Rev. 0
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
©2015 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
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HMC1118
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Positive Supply Voltage (VDD) Range
Negative Supply Voltage (VSS) Range
Control Voltage (VCTRL) Range
Logic Select (LS) Voltage Range
RF Input Power1 (VDD/VCTRL = 3.3 V, VSS = −2.5 V,
TA = 85°C, Frequency = 2 GHz)
Through Path
Termination Path
Hot Switch Power Level (VDD = 3.3 V,
TA = 85°C, Frequency = 2 GHz)
Storage Temperature Range
Maximum Reflow Temperature (MSL3 Rating)
Channel Temperature
Thermal Resistance (Channel to Package
Bottom)
Through Path
Terminated Path
ESD Sensitivity (HBM), Class 2
Rating
−0.3 V to +3.7 V dc
−2.8 V to +0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
See Figure 2 to
Figure 4
37 dBm
28 dBm
30 dBm
−65°C to +150°C
260°C
135°C
116°C/W
100°C/W
2 kV
1 For recommended operating conditions, see Table 1.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
4
0
–4
–8
–12
–16
–20
–24
0
1 2 3 4 5 6 7 8 9 10
FREQUENCY (GHz)
Figure 2. Power Derating Through Path
4
0
–4
–8
–12
–16
–20
–24
0.01
0.1 1 10 100
FREQUENCY (MHz)
1000
Figure 3. Power Derating Through Path (Low Frequency Detail)
4
0
–4
–8
–12
–16
–20
–24
0.01
0.1
1 10 100
FREQUENCY (MHz)
1000
10000
Figure 4. Power Derating for Hot Switching Power
ESD CAUTION
Rev. 0 | Page 5 of 11
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HMC1118
OUTLINE DIMENSIONS
PIN 1
INDICATOR
0.95
0.85
0.75
SEATING
PLANE
3.10
3.00 SQ
2.90
TOP VIEW
0.50
BSC
0.30
0.25
0.20
13
12
16
1
EXPOSED
PAD
PIN 1
INDICATOR
1.92
1.70 SQ
1.48
*0.35
0.30
0.25
9
8
4
5
BOTTOM VIEW
0.20 MIN
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
*COMPLIANT WITH JEDEC STANDARDS MO-220-VEED-4
WITH THE EXCEPTION OF PACKAGE EDGE TO LEAD EDGE.
Figure 20. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
3 mm × 3 mm Body, Very Very Thin Quad
(CP-16-38)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
HMC1118LP3DE
Temperature Range MSL Rating2 Package Description
−40°C to +85°C
MSL3
16-Lead Lead Frame Chip Scale Package [LFCSP]
HMC1118LP3DETR −40°C to +85°C
MSL3
16-Lead Lead Frame Chip Scale Package [LFCSP]
EV1HMC1118LP3D
1 HMC1118LP3DE and HMC1118LP3DETR are RoHS-Compliant Parts.
2 See the Absolute Maximum Ratings section.
3 XXXX is the 4-digit lot number.
Evaluation Board
Package
Option
CP-16-38
CP-16-38
Branding3
H1118
XXXX
H1118
XXXX
©2015 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D12961-0-10/15(0)
Rev. 0 | Page 11 of 11
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| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet HMC1118.PDF ] | |
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