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PDF HMC656 Data sheet ( Hoja de datos )

Número de pieza HMC656
Descripción WIDEBAND FIXED ATTENUATOR
Fabricantes Hittite Microwave 
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No Preview Available ! HMC656 Hoja de datos, Descripción, Manual

HMC650 TO HMC658
v01.0308
WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658
Typical Applications
2 The HMC650 through HMC658 are ideal for:
• Fiber Optics
• Microwave Radio
• Military & Space Hybrids
• Test & Measurement
• Scientific Instruments
• RF / Microwave Circuit Prototyping
Features
Wide Bandwidth: DC - 50 GHz
9 Attenuator Products:
0, 2, 3, 4, 6, 10, 15, & 20 dB Fixed Levels
Power Handling: +25 dBm
HMC651 & HMC658
Die Size: 0.57 x 0.45 x 0.1 mm
HMC650, HMC652, HMC653, HMC654
HMC655, HMC656 & HMC657
Die Size: 0.42 x 0.45 x 0.1 mm
Included in the HMC-DK006 Designer’s Kit
Functional Diagrams
HMC650, HMC652, HMC653, HMC654,
HMC655, HMC656 & HMC657
General Description
The HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657
/ 658 are a line of wideband fixed value 50 Ohm mat-
ched attenuator chips which offer relative attenuation
levels of 0, 2, 3, 4, 6, 10, 15 and 20 dB. These passive
though-lines and attenuators are ideal for microstrip,
hybrid, and multi-chip module applications where
extremely flat attenuation, and excellent VSWR vs.
frequency are required.
These wideband attenuators feature low inductance
on-chip vias, and require no additional ground
connections. The HMC650 through HMC658 are
backside metallized with gold, and are suitable for
eutectic or epoxy die attach. Each of the 9 products
can be purchased individually by their respective
part number or in a set of 10 each in the HMC-DK006
Fixed Attenuator Chip Designer’s Kit.
HMC651, HMC658
2-2
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com

1 page




HMC656 pdf
HMC650 TO HMC658
v01.0308
WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658
Outline Drawing
HMC650, HMC652, HMC653, HMC654, HMC655, HMC656 HMC657
2
Outline Drawing
HMC651 & HMC658
Die Packaging Information [1]
Standard
Alternate
GP-5 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES (MILLIMETERS).
2. TYPICAL BOND PAD IS .004” SQUARE.
3. TYPICAL BOND PAD SPACING IS .006” CENTER TO
CENTER EXCEPT AS NOTED.
4. BACKSIDE METALIZATION: GOLD
5. BACKSIDE METAL IS GROUND
6. BOND PAD METALIZATION: GOLD
7. DO NOT BOND ON TOP OF GROUND VIAS
8. OVERALL DIE SIZE ±0.002”
2-6
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com

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