ZWIR4512 PDF даташит
Спецификация ZWIR4512 изготовлена «IDT» и имеет функцию, называемую «Secure Low-Power Wireless IPv6 Module». |
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Детали детали
Номер произв | ZWIR4512 |
Описание | Secure Low-Power Wireless IPv6 Module |
Производители | IDT |
логотип |
27 Pages
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Secure Low-Power
Wireless IPv6 Module
ZWIR4512
Datasheet
Brief Description
The ZWIR4512 enables secure low-power wireless
IPv6 communication for sensors and small devices.
IDT provides a user-programmable, royalty-free
6LoWPAN stack with mesh routing capability with
the ZWIR4512. 6LoWPAN is an Internet Engineer-
ing Task Force (IETF) standard for building wireless,
low-power IP-based sensor and device networks.
These networks can easily be integrated into exist-
ing IT infrastructure or operate autonomously.
Secure communication is provided by standard-
compliant implementations of the Internet Protocol
Security (IPSec) protocol suite and the Internet Key
Exchange Protocol version 2 (IKEv2), which enable
highly secure end-to-end communication, including
over unsecure network nodes.
The module is powered by an ARM® Cortex™-M3
(ARM, Ltd. trademark) microcontroller and provides
a rich set of GPIO and peripheral interfaces. Up to
192kB of flash and 32kB of RAM are available for
applications. Different low power modes are pro-
vided to save energy in battery-operated devices.
The modules provide superior radio properties with-
out the need for complicated external RF design.
Benefits
• Uniquely simple programmability
• Standard-compliant security solution
• No need for external microcontroller
• Plug-and-play integration into local and wide-
area networks
• No RF design required
• 2D barcode label containing MAC address
• Superior radio propagation
• ETSI/FCC certified
Typical ZWIR4512 Application Setup
LAN
Cloud /
Internet
PAN WAN
Specific Devices:
ZWIR45xx
Device
ZWIR45xx
Gateway
Off-the-Shelf
Components:
LAN
Router
Handheld
Device
Computer
Hardware Features
• License-free 868/915 MHz frequency bands
• ARM® Cortex™-M3 32-bit microcontroller
• ≤192kB flash and 32kB RAM for user applications
• Unique EUI64 address
• 4 channels in EU mode; 10 channels in US mode
• 19 (ZWIR4512AC1) or 21 (ZWIR4512AC2)
GPIOs with multiplexed peripheral functions:
2 x UART, SPI, 3 x ADC, 2 x DAC, 11 x PWM,
USB, CAN, I2C™ (NXP trademark), 8 x timer
Several 5V tolerant I/Os available
• Low current consumption: 3.5 µA in Standby
Mode; 10.5 mA in Receive Mode; 16.0 mA in
Transmit Mode @ 0 dBm
• Modulation schemes
BPSK (20 kBps EU, 40 kBps US)
O-QPSK (100 kBps EU, 250 kBps US)
• Receiver sensitivity: up to -110 dBm
• TX output power: up to 10 dBm (US Mode)
Firmware Features
• Serial command interface with built-in security
and over-the-air update (OTAU) functionality
• Royalty-free library bundle for custom firmware:
6LoWPAN communication library with mesh
routing capability; IPSec and IKEv2 security
libraries; over-the-air update library; several
peripheral libraries
Available Support
• Development Kit
• Programming guide and application notes
• Ethernet, USB and UART gateways
• Free packet sniffer and example programs
demonstrating C-API usage
• Windows® (Microsoft Corp. trademark) and
Linux® (Linus Torvalds trademark) support tools
Physical Characteristics
• Supply voltage: 2.0 V to 3.6 V
• Operating temperature: -40 °C to +85 °C
• 30-pin edge-board contact package or
32-pin land grid array package
© 2016 Integrated Device Technology, Inc.
1
January 27, 2016
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Stack Architecture
Secure Low-Power
Wireless IPv6 Module
ZWIR4512
Datasheet
Applications
The ZWIR4512 serves as a universal secure radio
communication module. Typical applications include
home and industry automation, health monitoring,
smart metering / smart grid applications, and key-
less entry systems.
Its very low current consumption makes the module
suitable for battery-operated devices.
RF – Transceiver
Microcontroller
AAADDDCCC ADDACCDACAUDARCT
ARM®
Cortex™-M3
AAPDDWCCM AADTDICMC
SPI
USB
CAN
I2C™
General Purpose & Peripheral IO
Ordering Information
Product Sales Code
ZWIR4512AC1xA
ZWIR4512AC1xI
ZWIR4512AC2xA
ZWIR4512AC2xI
ZWIR4512-Devkit
Description
Unprogrammed module for user application programs
Preprogrammed module with serial command interface
Unprogrammed module for user application programs
Preprogrammed module with serial command interface
Development Kit
Package
30 pin SMT, 27.9 mm x 16.5 mm
30 pin SMT, 27.9 mm x 16.5 mm
32 pin LGA, 23.1 mm x 15.1 mm
32 pin LGA, 23.1 mm x 15.1 mm
Corporate Headquarters
6024 Silver Creek Valley Road
San Jose, CA 95138
www.IDT.com
Sales
1-800-345-7015 or 408-284-8200
Fax: 408-284-2775
www.IDT.com/go/sales
Tech Support
www.IDT.com/go/support
DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance
specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The
information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose,
an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual
property rights of IDT or any third parties.
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be
reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the
property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary. All contents of this document are copyright of
Integrated Device Technology, Inc. All rights reserved.
© 2016 Integrated Device Technology, Inc.
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ZWIR4512 Datasheet
Contents
1 Module Characteristics........................................................................................................................................ 5
1.1. Absolute Maximum Ratings.......................................................................................................................... 5
1.1.1. Voltage Characteristics .......................................................................................................................... 5
1.1.2. Current Characteristics .......................................................................................................................... 5
1.1.3. Thermal Characteristics ......................................................................................................................... 5
1.2. Operating Conditions .................................................................................................................................... 5
1.2.1. General Operating Conditions ............................................................................................................... 5
1.2.2. Current Consumption per Operating Mode............................................................................................ 7
2 Module Description.............................................................................................................................................. 7
2.1. Radio Transceiver ........................................................................................................................................ 8
2.2. Microcontroller .............................................................................................................................................. 8
2.2.1. MCU Core .............................................................................................................................................. 8
2.2.2. Peripherals and Interfaces ..................................................................................................................... 8
2.2.3. Programming and Debugging ................................................................................................................ 8
2.3. Firmware....................................................................................................................................................... 9
2.3.1. Serial Command Interface (SCI) Firmware............................................................................................ 9
2.3.2. C Application Programming Interface (C-API) ....................................................................................... 9
2.4. Power Modes................................................................................................................................................ 9
2.4.1. Run Mode............................................................................................................................................. 10
2.4.2. Sleep Mode .......................................................................................................................................... 10
2.4.3. Stop Mode............................................................................................................................................ 10
2.4.4. Standby Mode ...................................................................................................................................... 10
3 Application Circuits ............................................................................................................................................ 11
3.1. Power Supply.............................................................................................................................................. 11
3.2. Reset and Boot Select................................................................................................................................ 12
3.3. Debug Access............................................................................................................................................. 12
3.4. Antenna ...................................................................................................................................................... 13
4 Pinout ................................................................................................................................................................ 14
5 Package Dimensions and PCB Footprints ........................................................................................................ 21
5.1. ZWIR4512AC1............................................................................................................................................ 21
5.2. ZWIR4512AC2............................................................................................................................................ 22
6 Soldering Information ........................................................................................................................................ 23
7 Customization.................................................................................................................................................... 24
8 Certification........................................................................................................................................................ 24
8.1. European R&TTE Directive Statements..................................................................................................... 24
8.2. Federal Communication Commission Certification Statements ................................................................. 24
8.2.1. Statements ........................................................................................................................................... 24
© 2016 Integrated Device Technology, Inc.
3
January 27, 2016
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