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PDF HMC490LP5E Data sheet ( Hoja de datos )
| Número de pieza | HMC490LP5E | |
| Descripción | GaAs pHEMT MMIC LOW NOISE HIGH IP3 AMPLIFIER | |
| Fabricantes | Analog Devices | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de HMC490LP5E (archivo pdf) en la parte inferior de esta página. Total 8 Páginas | ||
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v04.0213
Typical Applications
The HMC490LP5(E) is ideal for:
• Point-to-Point Radios
• Point-to-Multi-Point Radios
• VSAT
• Military EW, ECM & C3I
Functional Diagram
HMC490LP5 / 490LP5E
GaAs pHEMT MMIC LOW NOISE
HIGH IP3 AMPLIFIER, 12 - 16 GHz
Features
Noise Figure: 2.5 dB
P1dB Output Power: +25 dBm
Gain: 23 dB
Output IP3: +34 dBm
+5V Supply
50 Ohm Matched Input/Output
32 Lead 5x5mm SMT Package: 25mm²
General Description
The HMC490LP5(E) is a high dynamic range GaAs
pHEMT MMIC Low Noise Amplifier which operates
between 12 and 16 GHz. The HMC490LP5(E) provides
23 dB of gain, 2.5 dB noise figure and an output IP3
of +34 dBm from a +5V supply voltage. This versatile
amplifier combines excellent, stable +25 dBm P1dB
output power with very low noise figure making it ideal
for receive and transmit applications. The amplifier is
packaged in a leadless 5x5 mm QFN surface mount
package.
Electrical Specifications, TA = +25° C, Vdd = 5V, Idd = 200 mA*
Parameter
Frequency Range
Gain
Gain Variation Over Temperature
Noise Figure
Input Return Loss
Output Return Loss
Output Power for 1 dB Compression (P1dB)
Saturated Output Power (Psat)
Output Third Order Intercept (IP3)
Supply Current (Idd)(Vdd = 5V, Vgg = -0.8V Typ.)
* Adjust Vgg between -2 to 0V to achieve Idd = 200 mA typical.
Min.
20
22
Typ.
12 - 16
23
0.03
2.5
8
8
25
27
34
200
Max.
0.04
3.5
Units
GHz
dB
dB/ °C
dB
dB
dB
dBm
dBm
dBm
mA
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1 page  
v04.0213
Outline Drawing
HMC490LP5 / 490LP5E
GaAs pHEMT MMIC LOW NOISE
HIGH IP3 AMPLIFIER, 12 - 16 GHz
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
LAND PATTERN.
Package Information
Part Number
HMC490LP5
Package Body Material
Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
HMC490LP5E RoHS-compliant Low Stress Injection Molded Plastic
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
100% matte Sn
MSL Rating
MSL1 [1]
MSL1 [2]
Package Marking [3]
H490
XXXX
H490
XXXX
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5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet HMC490LP5E.PDF ] | |
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