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PDF HMC634 Data sheet ( Hoja de datos )
| Número de pieza | HMC634 | |
| Descripción | GaAs PHEMT MMIC DRIVER AMPLIFIER | |
| Fabricantes | Analog Devices | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de HMC634 (archivo pdf) en la parte inferior de esta página. Total 8 Páginas | ||
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v01.0308
Typical Applications
2 The HMC634 is ideal for:
• Point-to-Point Radios
• Point- to-Multi-Point Radios & VSAT
• LO Driver for Mixers
• Military & Space
Functional Diagram
HMC634
GaAs PHEMT MMIC DRIVER
AMPLIFIER, 5 - 20 GHz
Features
Gain: 22 dB
P1dB: +23 dBm
Output IP3: +31 dBm
Saturated Power: 24 dBm @ 23% PAE
Supply Voltage: +5 V @ 180 mA
50 Ohm Matched Input/Output
Die Size: 2.07 x 0.97 x 0.10 mm
General Description
The HMC634 is a GaAs MMIC PHEMT Driver
Amplifier die which operates between 5 and 20 GHz.
The amplifier provides up to 22 dB of gain, +31 dBm
Output IP3, and up to +23 dBm of output power at 1 dB
gain compression, while requiring 180 mA from a +5V
supply. The HMC634 is an ideal driver amplifier for
microwave radio applications from 5 to 20 GHz, and
may be biased at +5V, 130 mA to provide 2 dB lower
gain with improved PAE. The HMC634 amplifier I/O’s
are DC blocked and internally matched to 50 Ohms
facilitating easy integration into Multi-Chip-Modules
(MCMs). All data is taken with die connected at input
and output RF ports via one 1 mil wedge bond with
minimal length of 0.31 mm (12 mils).
Electrical Specifications, TA = +25° C, Vdd1, Vdd2, Vdd3, Vdd4= 5V, Idd= 180mA[1]
Parameter
Frequency Range
Gain
Gain Variation Over Temperature
Input Return Loss
Output Return Loss
Output Power for 1 dB Compression (P1dB)
Saturated Output Power (Psat)
Output Third Order Intercept (IP3)
Noise Figure
Supply Current (Idd1 + Idd2 + Idd3 + Idd4)
[1]Adjust Vgg between -2 to 0V to achieve Idd = 180mA Typical
Min.
17
21
Typ. Max.
5 - 16
22
0.030 0.040
12
12
23
24
31
7
180
Min. Typ. Max. Units
16 - 20
GHz
17 20
dB
0.025 0.035 dB/ °C
9 dB
11 dB
18 21
dBm
22 dBm
30 dBm
7.5 dB
180 mA
2 - 50
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1 page  
v01.0308
Outline Drawing
2
HMC634
GaAs PHEMT MMIC DRIVER
AMPLIFIER, 5 - 20 GHz
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND IS .004” SQUARE
4. BACKSIDE METALLIZATION: GOLD
5. BOND PAD METALLIZATION: GOLD
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
Die Packaging Information [1]
Standard
Alternate
GP-2 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
2 - 54
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5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet HMC634.PDF ] | |
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