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PDF HMC637ALP5E Data sheet ( Hoja de datos )
| Número de pieza | HMC637ALP5E | |
| Descripción | GaAs pHEMT MMIC 1 WATT POWER AMPLIFIER | |
| Fabricantes | Analog Devices | |
| Logotipo |  |
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v01.0914
Typical Applications
The HMC637ALP5E wideband PA is ideal for:
• Telecom Infrastructure
• Microwave Radio & VSAT
• Military & Space
• Test Instrumentation
• Fiber Optics
Functional Diagram
HMC637ALP5E
GaAs pHEMT MMIC 1 WATT
POWER AMPLIFIER, DC - 6 GHz
Features
P1dB Output Power: +29 dBm
Gain: 13 dB
Output IP3: +44 dBm
50 Ohm Matched Input/Output
32 Lead 5x5mm Lead SMT Package: 25 mm2
General Description
The HMC637ALP5E is a GaAs MMIC pHEMT
Distributed Power Amplifier which operates bet-
ween DC and 6 GHz. The amplifier provides 13 dB
of gain, +44 dBm output IP3 and +29 dBm of output
power at 1 dB gain compression while requiring 400
mA from a +12V supply. Gain flatness is excellent at
±0.75 dB from DC - 6 GHz making the HMC637ALP5E
ideal for EW, ECM, Radar and test equipment
applications. The HMC637ALP5E amplifier I/Os
are internally matched to 50 Ohms and the 5x5 mm
QFN package is compatible with high volume SMT
assembly equipment.
Electrical Specifications, TA = +25° C, Vdd= +12V, Vgg2= +5V, Idd= 400 mA[1]
Parameter
Gain
Gain Flatness
Gain Variation Over Temperature
Input Return Loss
Output Return Loss
Output Power for 1 dB Compression (P1dB)
Saturated Output Power (Psat)
Output Third Order Intercept (OIP3)[2]
Frequency
DC - 6.0 GHz
DC - 6.0 GHz
DC - 6.0 GHz
DC - 6.0 GHz
DC - 6.0 GHz
DC - 6.0 GHz
DC - 6.0 GHz
DC - 6.0 GHz
Min.
12
27
Typ.
13
±0.75
0.015
12
15
29
31
44
Max.
Noise Figure
DC - 2.0 GHz
2.0 - 6.0 GHz
12
5
Supply Current (Idd)
320 400 480
[1] Adjust Vgg1 between -2 to 0V to achieve Idd= 400 mA typical.
[2] Two-Tone Output Power = +10 dBm Each Tone, 1 MHz Spacing.
Units
dB
dB
dB/ °C
dB
dB
dBm
dBm
dBm
dB
dB
mA
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1 page  
v01.0914
Outline Drawing
HMC637ALP5E
GaAs pHEMT MMIC 1 WATT
POWER AMPLIFIER, DC - 6 GHz
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
LAND PATTERN.
Package Information
Part Number
Package Body Material
HMC637ALP5E RoHS-compliant Low Stress Injection Molded Plastic
[1] Max peak reflow temperature of 260 °C
[2] 4-Digit lot number XXXX
Lead Finish
100% matte Sn
MSL Rating
MSL3 [1]
Package Marking [2]
H637A
XXXX
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5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet HMC637ALP5E.PDF ] | |
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