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PDF HMC199AMS8E Data sheet ( Hoja de datos )
| Número de pieza | HMC199AMS8E | |
| Descripción | DUAL SPDT SWITCH | |
| Fabricantes | Analog Devices | |
| Logotipo |  |
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HMC199AMS8 / 199AMS8E
v00.0814
DUAL SPDT SWITCH
DC - 2.5 GHz
Typical Applications
The HMC199AMS8 / 199AMS8E is ideal for:
• Cellular
• ISM Basestations
• PCS
Features
RoHS-Compliant Product
Integrated Dual SPDTs
Low Insertion Loss: <0.5 dB @ 2 GHz
Positive Control: 0/+5V, 0/+3V
Ultra Small MSOP8 Package: 14.8 mm2
Functional Diagram
General Description
The HMC199AMS8 & HMC199AMS8E are low-cost
general purpose dual SPDT GaAs “bypass” switches
in 8-lead MSOP packages covering DC to 2.5 GHz.
These four-RF-port components integrate two
SPDT switches and a through line onto a single IC.
The designs provide low insertion loss of less than
0.5 dB while switching passive or active external cir-
cuit components in and out of the signal path. Port
to port isolations are typically 25 to 30 dB. On-chip
circuitry enables positive voltage control operation at
very low DC currents with control inputs compatible
with CMOS and most TTL logic families. Applications
include LNA or filter bypass switching and single bit
attenuator switching. The HMC199AMS8E is a RoHS-
compliant product.
Electrical Specifications, TA = +25° C, Vctl = 0/+5 Vdc, 50 Ohm System
Insertion Loss
Parameter
Isolation (Between Ports RFC1 and RFC2 / RF1 / RF2)
Return Loss (On State, Any Port)
Input Power for 1 dB Compression
Input Third Order Intercept
(Two-tone Input Power = 13 dBm Each Tone)
Switching Characteristics
tRISE, tFALL (10/90% RF)
tON, tOFF (50% CTL to 10/90% RF)
Frequency
DC - 1.0 GHz
DC - 2.0 GHz
DC - 2.5 GHz
DC - 2.0 GHz
DC - 2.5 GHz
DC - 2.0 GHz
DC - 2.5 GHz
0.5 - 2.0 GHz
0.5 - 2.0 GHz
DC - 2.5 GHz
Min.
22
17
20
20
25
40
Typ.
0.3
0.4
0.6
25
22
30
30
28
55
20
40
Max.
0.6
0.8
1.0
Units
dB
dB
dB
dB
dB
dB
dB
dBm
dBm
ns
ns
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1 page  
Outline Drawing
HMC199AMS8 / 199AMS8E
v00.0814
DUAL SPDT SWITCH
DC - 2.5 GHz
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS].
3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Package Information
Part Number
Package Body Material
HMC199AMS8
Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
HMC199AMS8E RoHS-compliant Low Stress Injection Molded Plastic
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
100% matte Sn
MSL Rating
MSL1 [1]
MSL1 [2]
Package Marking [3]
H199A
XXXX
H199A
XXXX
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4
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| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet HMC199AMS8E.PDF ] | |
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