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PDF HMC432E Data sheet ( Hoja de datos )
| Número de pieza | HMC432E | |
| Descripción | SMT GaAs HBT MMIC | |
| Fabricantes | Analog Devices | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de HMC432E (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
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v04.0410
Typical Applications
4 Prescaler for DC to C Band PLL Applications:
• UNII, Point-to-Point & VSAT Radios
• 802.11a & HiperLAN WLAN
• Fiber Optic
• Cellular / 3G Infrastructure
Functional Diagram
HMC432 / 432E
SMT GaAs HBT MMIC
DIVIDE-BY-2, DC - 8 GHz
Features
Ultra Low SSB Phase Noise: -148 dBc/Hz
Single-Ended I/O’s
Output Power: -3 to -9 dBm
Single DC Supply: +3V @ 42 mA
9 mm2 Ultra Small Package: SOT26
General Description
The HMC432(E) is a low noise Divide-by-2 Static
Divider utilizing InGaP GaAs HBT technology in
ultra small surface mount SOT26 plastic packages.
This device operates from DC (with a square
wave input) to 8 GHz input frequency with a single
+3V DC supply. Single-ended inputs and outputs
reduce component count and cost. The low additive
SSB phase noise of -148 dBc/Hz at 100 kHz offset
helps the user maintain good system noise
performance.
Electrical Specifications, TA = +25° C, 50 Ohm System, Vcc= +3V
Parameter
Conditions
Maximum Input Frequency
Minimum Input Frequency
Sine Wave Input. [1]
Input Power Range
Fin= 1 to 7 GHz
Fin= 7 to 8 GHz
Output Power
Fin= 4 GHz
Fin= 8 GHz
Reverse Leakage
RF Output Terminated, Fin= 4 GHz, Pin= 0 dBm
SSB Phase Noise (100 kHz offset)
Pin= 0 dBm, Fin= 4 GHz
Output Transition Time
Pin= 0 dBm, Fout= 882 MHz
Supply Current (Icc)
Vcc= 3.0 V
1. Divider will operate down to DC for square-wave input signal.
Min.
8
-12
-4
-6
-12
Typ.
8.5
0.2
-3
-9
-30
-148
145
42
Max.
+12
+10
56
Units
GHz
GHz
dBm
dBm
dBm
dBm
dBc/Hz
ps
mA
4 - 66
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1 page  
v04.0410
Outline Drawing
HMC432 / 432E
SMT GaAs HBT MMIC
DIVIDE-BY-2, DC - 8 GHz
4
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS].
3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Package Information
Part Number
Package Body Material
HMC432
Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
HMC432E
RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
MSL Rating
MSL1 [1]
MSL1 [2]
Package Marking [3]
H432
XXXX
432E
XXXX
Pin Description
Pin Number
Function
1, 4 N/C
2 GND
Description
The pins are not connected internally; however, all
data shown herein was measured with these pins
connected to RF/DC ground externally.
Pin must connect to RF/DC ground.
3 IN
RF input must be DC blocked.
Interface Schematic
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4 - 69
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet HMC432E.PDF ] | |
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