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PDF HMC942LP4E Data sheet ( Hoja de datos )
| Número de pieza | HMC942LP4E | |
| Descripción | SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER | |
| Fabricantes | Analog Devices | |
| Logotipo |  |
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v02.1210
HMC942LP4E
SMT GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 25 - 31 GHz OUTPUT
Typical Applications
The HMC942LP4E is ideal for:
• Clock Generation Applications:
SONET OC-192 & SDH STM-64
• Point-to-Point & VSAT Radios
5 • Test Instrumentation
• Military & Space
• Sensors
Features
High Output Power: +21 dBm
Low Input Power Drive: 0 to +6 dBm
Fo Isolation: >45 dBc
Single Supply: +4.5V @ 214 mA
24 Lead 4x4 mm SMT Package: 16 mm²
Functional Diagram
General Description
The HMC942LP4E is a x2 active broadband frequ-
ency multiplier utilizing GaAs pHEMT technology
in a leadless RoHS compliant SMT package. When
driven by a +4 dBm signal, the multiplier provides
+17 dBm typical output power from 13 to 24.6 GHz.
The Fo and 3Fo isolations are >20 dBc at 19 GHz. The
HMC942LP4E is ideal for use in LO multiplier chains
for Pt-to-Pt & VSAT Radios yielding reduced parts
count vs. traditional approaches.
Electrical Specifications, TA = +25° C, Vdd = +4.5V, +4 dBm Drive Level
Parameter
Min. Typ. Max. Min. Typ.
Frequency Range, Input
12.5 - 15.0
15.0 - 15.5
Frequency Range, Output
25 - 30
30 - 31
Output Power
17 21
14 18
Fo Isolation (with respect to output level)
55 55
Input Return Loss
4 12
49
Output Return Loss
6 12
5 10
Supply Current (Idd1 & Idd2)
214 240
214
Max.
240
Units
GHz
GHz
dBm
dBc
dB
dB
mA
5-1
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1 page  
v02.1210
HMC942LP4E
SMT GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 25 - 31 GHz OUTPUT
Absolute Maximum Ratings
RF Input (Vdd = +5V)
Supply Voltage (Vdd1, Vdd2)
Channel Temperature
Continuous Pdiss (T= 85 °C)
(derate 16.4 mW/°C above 85 °C)
Thermal Resistance
(channel to ground paddle)
Storage Temperature
Operating Temperature
ESD Sensitivity (HBM)
+10 dBm
+5.5 Vdc
175 °C
1.48 W
60 °C/W
-65 to +150 °C
-40 to +85 °C
Class 1B
Typical Supply Current vs. Vdd
Vdd (Vdc)
4.0
4.5
5.0
Idd (mA)
211
214
217
Note:
Multiplier will operate over full voltage range shown above.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
5
Outline Drawing
Package Information
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
5. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO
PCB RF GROUND.
Part Number
Package Body Material
HMC942LP4E RoHS-compliant Low Stress Injection Molded Plastic
[1] 4-Digit lot number XXXX
[2] Max peak reflow temperature of 260 °C
Lead Finish
100% matte Sn
MSL Rating
MSL1 [2]
Package Marking [1]
H942
XXXX
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5-4
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