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PDF HMC558LC3B Data sheet ( Hoja de datos )
| Número de pieza | HMC558LC3B | |
| Descripción | GaAs MMIC FUNDAMENTAL MIXER | |
| Fabricantes | Analog Devices | |
| Logotipo |  |
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v03.0514
Typical Applications
The HMC558LC3B is ideal for:
• Point-to-Point Radios
• Point-to-Multi-Point Radios
• Test Equipment & Sensors
• Military End-Use
Functional Diagram
HMC558LC3B
GaAs MMIC FUNDAMENTAL
MIXER, 5.5 - 14.0 GHz
Features
Passive Double Balanced Topology
High LO/RF Isolation: 45 dB
Low Conversion Loss: 7 dB
Wide IF Bandwidth: DC - 6 GHz
12 Lead Ceramic 3x3mm SMT Package: 9mm2
General Description
The HMC558LC3B is a general purpose double
balanced mixer in a leadless RoHS compliant SMT
package that can be used as an upconverter or
downconverter between 5.5 and 14 GHz. This mixer
is fabricated in a GaAs MESFET process, and
requires no external components or matching cir-
cuitry. The HMC558LC3B provides excellent LO to
RF and LO to IF isolation due to optimized balun
structures and operates with LO drive levels as low as
+9 dBm. The RoHS compliant HMC558LC3B elim-
inates the need for wire bonding, and is compatible
with high volume surface mount manufacturing
techniques.
Electrical Specifications, TA = +25° C, IF= 100 MHz, LO= +15 dBm*
Parameter
Min. Typ. Max. Min. Typ.
Frequency Range, RF & LO
5.5 - 10.0
Frequency Range, IF
DC - 6
Conversion Loss
7 9.5
Noise Figure (SSB)
7 9.5
LO to RF Isolation
35 45
LO to IF Isolation
20 25
RF to IF Isolation
8 14
IP3 (Input)
20
IP2 (Input)
54
1 dB Gain Compression (Input)
11
*Unless otherwise noted, all measurements performed as downconverter, IF= 100 MHz.
10.0 - 14.0
DC - 6
8.5
8.5
30 36
20 25
10 16
24
46
13
Max.
10
10
Units
GHz
GHz
dB
dB
dB
dB
dB
dBm
dBm
dBm
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1 page  
v03.0514
Absolute Maximum Ratings
RF / IF Input
LO Drive
Channel Temperature
Continuous Pdiss (T = 85 °C)
(derate 3.25 mW/°C above 85 °C)
Thermal Resistance
(channel to ground paddle)
Storage Temperature
Operating Temperature
+25 dBm
+25 dBm
150 °C
211 mW
307 °C/W
-65 to +150 °C
-40 to +85 °C
Outline Drawing
HMC558LC3B
GaAs MMIC FUNDAMENTAL
MIXER, 5.5 - 14.0 GHz
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
NOTES:
1. PACKAGE BODY MATERIAL: ALUMINA.
2. LEAD AND GROUND PADDLE PLATING:
30-80 MICROINCHES GOLD OVER 50 MICROINCHES MINIMUM NICKEL.
3. DIMENSIONS ARE IN INCHES (MILLIMETERS).
4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
5. CHARACTERS TO BE HELVETICA MEDIUM, .025 HIGH, BLACK INK,
OR LASER MARK LOCATED APPROX. AS SHOWN.
6. PACKAGE WARP SHALL NOT EXCEED 0.05MM DATUM – C –
7. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
Package Information
Part Number
Package Body Material
HMC558LC3B
Alumina, White
[1] Max peak reflow temperature of 260 °C
[2] 4-Digit lot number XXXX
Lead Finish
Gold over Nickel
MSL Rating
MSL3 [1]
Package Marking [2]
H558
XXXX
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