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PDF NRVBB1060W1 Data sheet ( Hoja de datos )
| Número de pieza | NRVBB1060W1 | |
| Descripción | SWITCHMODE Power Rectifier | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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NRVBB1060,
NRVBB1060W1
Switch-mode Power
Rectifier
This switch−mode power rectifier uses the Schottky Barrier
principle with a platinum barrier metal. This state−of−the−art device
has the following features:
Features
• Low Forward Voltage
• 175°C Operating Junction Temperature
• Low Power Loss/High Efficiency
• High Surge Capacity
• For Automotive and Other Applications Requiring Unique Site and
Control Change Requirements; AEC−Q101 Qualified and PPAP
Capable
• This is a Pb−Free Device
Applications
• Power Supply − Output Rectification
• Power Management
Mechanical Characteristics
• Case: Epoxy, Molded
• Epoxy Meets UL 94 V−0 @ 0.125 in
• Weight: 1.7 Grams (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
© Semiconductor Components Industries, LLC, 2016
January, 2016 − Rev. 3
1
www.onsemi.com
SCHOTTKY BARRIER
RECTIFIER
10 AMPERES, 60 VOLTS
1
3
STYLE 3
4
1
3
STYLE 6
4
4
1
3
D2PAK
CASE 418B
STYLE 3, 6
MARKING DIAGRAMS
AY WW
B1060G
xKA
AY WW
1060W1G
xKA
NRVBB1060
NRVBB1060W1
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
xKA = Diode Polarity
x = N or A
ORDERING INFORMATION
Device
Package Shipping†
NRVBB1060T4G
D2PAK 800/Tape & Reel
(Pb−Free)
NRVBB1060W1T4G D2PAK 800/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
NRVBB1060/D
1 page  
NRVBB1060, NRVBB1060W1
PACKAGE DIMENSIONS
D2PAK 3
CASE 418B−04
ISSUE L
C
E
−B−
V
W
4
123
S
−T−
SEATING
PLANE
G
K
D 3 PL
0.13 (0.005) M T B M
A
W
J
H
VARIABLE
CONFIGURATION
ZONE
L
M
R
M
N
L
U
M
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 418B−01 THRU 418B−03 OBSOLETE,
NEW STANDARD 418B−04.
INCHES
DIM MIN MAX
A 0.340 0.380
B 0.380 0.405
C 0.160 0.190
D 0.020 0.035
E 0.045 0.055
F 0.310 0.350
G 0.100 BSC
H 0.080 0.110
J 0.018 0.025
K 0.090 0.110
L 0.052 0.072
M 0.280 0.320
N 0.197 REF
P 0.079 REF
R 0.039 REF
S 0.575 0.625
V 0.045 0.055
MILLIMETERS
MIN MAX
8.64 9.65
9.65 10.29
4.06 4.83
0.51 0.89
1.14 1.40
7.87 8.89
2.54 BSC
2.03 2.79
0.46 0.64
2.29 2.79
1.32 1.83
7.11 8.13
5.00 REF
2.00 REF
0.99 REF
14.60 15.88
1.14 1.40
STYLE 3:
STYLE 6:
PIN 1. ANODE
PIN 1. NO CONNECT
2. CATHODE
2. CATHODE
P 3. ANODE 3. ANODE
4. CATHODE
4. CATHODE
L
F
VIEW W−W
1
FF
VIEW W−W
2
VIEW W−W
3
SOLDERING FOOTPRINT*
10.49
16.155
8.38
2X
3.504
2X
1.016
5.080
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet NRVBB1060W1.PDF ] | |
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