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PDF HMC425 Data sheet ( Hoja de datos )
| Número de pieza | HMC425 | |
| Descripción | 0.5 dB LSB GaAs MMIC 6-BIT DIGITAL POSITIVE CONTROL ATTENUATOR/ 2.4 - 8.0 GHz | |
| Fabricantes | Hittite Microwave Corporation | |
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v01.0402
HMC425
MICROWAVE CORPORATION
0.5 dB LSB GaAs MMIC 6-BIT DIGITAL
POSITIVE CONTROL ATTENUATOR, 2.4 - 8.0 GHz
Typical Applications
The HMC425 is ideal for:
2 • Fiber Optics & Broadband Telecom
• Microwave Radio & VSAT
• Military Radios, Radar, & ECM
• Space Applications
Functional Diagram
Features
0.5 dB LSB Steps to 31.5 dB
Single Control Line Per Bit
+/- 0.5 dB Typical Bit Error
Die Size: 0.85 mm x 1.5 mm x 0.1 mm
General Description
The HMC425 die is a broadband 6-bit GaAs IC
digital attenuator MMIC chip. Covering 2.4 to 8.0
GHz, the insertion loss is less then 3.5 dB typical.
The attenuator bit values are 0.5 (LSB), 1, 2, 4,
8, and 16 dB for a total attenuation of 31.5 dB.
Attenuation accuracy is excellent at ± 0.5 dB typi-
cal step error with an IIP3 of +40 dBm. Six con-
trol voltage inputs, toggled between 0 and +3 to
+5V, are used to select each attenuation state. A
single Vdd bias of +3 to +5V is required.
Electrical Specifications,
TA = +25° C, With Vdd = +5V & Vctl = 0/+5V (Unless Otherwise Noted)
Parameter
Frequency (GHz)
Min.
Typ.
Max.
Units
Insertion Loss
2.4 - 6.0 GHz
6.0 - 8.0 GHz
2.7 3.2 dB
3.5 4.0 dB
Attenuation Range
2.4 - 8.0 GHz
31.5
dB
Return Loss (RF1 & RF2, All Atten. States)
2.4 - 8.0 GHz 12 15
dB
Attenuation Accuracy: (Referenced to Insertion Loss)
All States
2.4 - 8.0 GHz
± 0.4 + 4% of Atten. Setting Max dB
Input Power for 0.1 dB Compression
Vdd= 5V
Vdd= 3V
2.4 - 8.0 GHz
22 dBm
19 dBm
Input Third Order Intercept Point
(Two-Tone Input Power= 0 dBm Each Tone)
REF - 16.0 dB States
16.5 - 31.5 dB States
2.4 - 8.0 GHz
45 dBm
35 dBm
Switching Characteristics
2.4 - 8.0 GHz
tRISE, tFALL (10/90% RF)
tON/tOFF (50% CTL to 10/90% RF)
160 ns
180 ns
2 - 14
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
1 page  
v01.0402
HMC425
MICROWAVE CORPORATION
0.5 dB LSB GaAs MMIC 6-BIT DIGITAL
POSITIVE CONTROL ATTENUATOR, 2.4 - 8.0 GHz
Assembly Diagram
2
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
The die should be attached directly to the ground plane eutectically or with conductive epoxy (see HMC general Han-
dling, Mounting, Bonding Note).
50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin film substrates are recommended for
bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the
die should be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface of the substrate. One
way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader
(moly-tab) which is then attached to the ground plane (Figure 2).
Microstrip substrates should be brought as close to the die as possible in order to minimize bond wire length. Typical
die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils).
2 - 18
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet HMC425.PDF ] | |
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