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PDF HMC444LP4 Data sheet ( Hoja de datos )
| Número de pieza | HMC444LP4 | |
| Descripción | SMT GaAs HBT MMIC x8 ACTIVE FREQUENCY MULTIPLIER | |
| Fabricantes | Hittite Microwave Corporation | |
| Logotipo |  |
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HMC444LP4 / 444LP4E
v04.0210
SMT GaAs HBT MMIC x8 ACTIVE
FREQUENCY MULTIPLIER, 9.9 - 11.2 GHz OUTPUT
Typical Applications
Active Multiplier for X Band Applications:
• Fiber Optic
• Point-to-Point Radios
• Military Radar
5
Functional Diagram
Features
Output Power: +6 dBm
Sub-Harmonic Suppression: >25 dBc
SSB Phase Noise: -136 dBc/Hz
Single Supply: +5V@ 68 mA
24 Lead 4x4 mm SMT Package: 16 mm2
General Description
The HMC444LP4 & HMC444LP4E are active
miniature x8 frequency multipliers utilizing InGaP
GaAs HBT technology in 4x4 mm leadless surface
mount packages. Power output is +6 dBm typical
from a 5V supply voltage and varies little vs. input
power, temperature and supply voltage. Suppression
of undesired fundamental and sub-harmonics is >25
dBc typical with respect to output signal level. The
low additive SSB phase noise of -136 dBc/Hz at 100
kHz offset helps the user maintain good system noise
performance. The HMC444LP4 & HMC444LP4E are
ideal for use in LO multiplier chains allowing reduced
parts count vs. traditional approaches.
Electrical Specifications, TA = +25° C, Vcc= 5V
Parameter
Frequency Range, Input
Frequency Range, Output
Input Power Range
Output Power
Sub-Harmonic Suppression
Input Return Loss
Output Return Loss
SSB Phase Noise (100 kHz Offset)
Supply Current (Icc)
Pin= 0 dBm
Min. Typ. Max.
1.2375 - 1.40
9.9 - 11.2
-15 +5
36
25
22
7
-136
68 91
Units
GHz
GHz
dBm
dBm
dBc
dB
dB
dBc/Hz
mA
5 - 48
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1 page  
HMC444LP4 / 444LP4E
v04.0210
SMT GaAs HBT MMIC x8 ACTIVE
FREQUENCY MULTIPLIER, 9.9 - 11.2 GHz OUTPUT
Absolute Maximum Ratings
RF Input (Vcc = +5V)
Vcc
Channel Temperature
Continuous Pdiss (T=85 °C)
(derate 10 mW/°C above 85 °C)
Thermal Resistance (R )
th
(junction to ground paddle)
Storage Temperature
Operating Temperature
+20 dBm
+5.5V
135 °C
650 mW
100 °C/W
-65 to +150 °C
-40 to +85 °C
Outline Drawing
Typical Supply Current vs. Vcc
Vcc (V)
4.5
5.0
5.5
Icc (mA)
66
68
70
Note: Multiplier will operate over full voltage range shown
above.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
5
Package Information
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
LAND PATTERN.
Part Number
HMC444LP4
Package Body Material
Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
HMC444LP4E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
MSL Rating
MSL1 [1]
MSL1 [2]
Package Marking [3]
H444
XXXX
H444
XXXX
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5 - 51
5 Page | ||
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| PDF Descargar | [ Datasheet HMC444LP4.PDF ] | |
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