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PDF HM658512ALTT-7 Data sheet ( Hoja de datos )

Número de pieza HM658512ALTT-7
Descripción 4 M PSRAM (512-kword x 8-bit) 2 k Refresh
Fabricantes Hitachi Semiconductor 
Logotipo Hitachi Semiconductor Logotipo



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No Preview Available ! HM658512ALTT-7 Hoja de datos, Descripción, Manual

HM658512A Series
4 M PSRAM (512-kword × 8-bit)
2 k Refresh
ADE-203-218C(Z)
Rev. 3.0
Nov. 1997
Description
The Hitachi HM658512A is a CMOS pseudo static RAM organized 512-kword × 8-bit. It realizes higher
density, higher performance and low power consumption by employing 0.8 µm Hi-CMOS process
technology.
It offers low power data retention by self refresh mode. It also offers easy non multiplexed address
interface and easy refresh functions. HM658512A is suitable for handy systems which work with battery
back-up systems.
The device is packaged in a small 525-mil SOP (460-mil body SOP) or a 8 × 20 mm TSOP with thickness
of 1.2 mm, or a 600-mil plastic DIP. High density custom cards made of Tape Carrier Packages are also
available.
Features
Single 5 V (±10%)
High speed
Access time
CE access time: 70/80/100 ns (max)
Cycle time
Random read/write cycle time:
115/130/160 ns (min)
Low power
Active: 250 mW (typ)
Standby: 200 µW (typ)
Directly TTL compatible
All inputs and outputs
Simple address configuration
Non multiplexed address
Refresh cycle
2048 refresh cycles: 32 ms

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HM658512ALTT-7 pdf
Block Diagram
A0
A10
I/O 0
I/O 7
CE
OE/RFSH
WE
HM658512A Series
Address
Latch
Control
Row
Decoder
Memory Matrix
(2048 × 256) × 8
Input
Data
Control
Column I/O
Column Decoder
Address Latch Control
Refresh
Control
Timing Pulse Gen.
Read Write Control
A11
A18
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HM658512ALTT-7 arduino
HM658512A Series
AC Characteristics (Ta = 0 to +70°C, VCC = 5 V ± 10%, unless otherwise noted.) (cont.)
HM658512A
-7 -8 -10
Parameter
Symbol Min Max Min Max Min Max Unit Notes
Data in to end of write
Data in hold time for write
Output active from end of write
Write to output in high-Z
Transition time (rise and fall)
Refresh command delay time
Refresh precharge time
Refresh command pulse width for
automatic refresh
t DW
t DH
t OW
t WHZ
tT
t RFD
t FP
t FAP
20 —
20 —
25 —
ns
0 — 0 — 0 — ns
5 — 5 — 5 — ns 2
— 20
— 20
— 25
ns 1, 2
3 50 3 50 3 50 ns 6
35 —
40 —
50 —
ns
35 —
40 —
40 —
ns
70 n 8 µ 80 n 8 µ 80 n 8 µ s
Automatic refresh cycle time
Refresh command pulse width for
self refresh
t FC
t FAS
115 —
8—
130 —
8—
160 —
8—
ns
µs
Refresh reset time from self refresh tRFS
Refresh period
t REF
600 —
— 32
600 —
— 32
600 —
— 32
ns 9
ms 2048
cycle
Notes: 1. tCHZ, tOHZ, tWHZ are defined as the time at which the output achieves the open circuit condition.
2. tCHZ, tCLZ, tOHZ, tOLZ, tWHZ and tOW are sampled under the condition of tT = 5 ns and not 100% tested.
3. A write occurs during the overlap of low CE and low WE. Write end is defined at the earlier of
WE going high or CE going high.
4. If the CE low transition occurs simultaneously with or from the WE low transition, the output
buffers remain in high impedance state.
5. In write cycle, OE or WE must disable output buffers prior to applying data to the device and at
the end of write cycle data inputs must be floated prior to OE or WE turning on output buffers.
During this period, I/O pins are in the output state, therefore the input signals of opposite phase
to the outputs must not be applied.
6. Transition time tT is measured between VIH (min) and VIL (max). VIH (min) and VIL (max) are
reference levels for measuring timing of input signals.
7. After power-up, pause for more than 100 µs and execute at least 8 initialization cycles.
8. 2048 cycles of burst refresh or the first cycle of distributed automatic refresh must be executed
within 15 µs after self refresh, in order to meet the refresh specification of 32 ms and 2048
cycles.
9. At the end of self refresh, refresh reset time (tRFS) is required to reset the internal self refresh
operation of the RAM. During tRFS, CE and OE/RFSH must be kept high. If automatic refresh
follows self refresh, low transition of OE/RFSH at the beginning of automatic refresh must not
occur during tRFS period.
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