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PDF HMC129 Data sheet ( Hoja de datos )
| Número de pieza | HMC129 | |
| Descripción | GaAs MMIC DOUBLE-BALANCED MIXER/ 4 - 8 GHz | |
| Fabricantes | Hittite Microwave Corporation | |
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v02.0802
MICROWAVE CORPORATION
HMC129
GaAs MMIC DOUBLE-BALANCED
MIXER, 4 - 8 GHz
Typical Applications
The HMC129 is ideal for:
• Microwave & VSAT Radios
• Test Equipment
• Military EW, ECM, C3I
• Space Telecom
Functional Diagram
5
Features
Conversion Loss: 7 dB
LO to RF and IF Isolation: 40 dB
Input IP3: +17 dBm
Small Size, No DC Bias Required
General Description
The HMC129 chip is a miniature double-bal-
anced mixer which can be used as an upcon-
verter or downconverter in the 4 to 8 GHz band.
The chip can be integrated directly into hybrid
MICs without DC bias or external baluns to pro-
vide an extremely compact mixer. It is ideally
suited for applications where small size, no DC
bias, and consistent IC performance are required.
This mixer can operate over a wide LO drive input
of +9 to +15 dBm. It performs equally well as a
Bi-Phase modulator or demodulator. See the
HMC136 data sheet.
5-8
Electrical Specifications, TA = +25° C, LO Drive = +15 dBm
Parameter
Min. Typ.
Frequency Range, RF & LO
4.0 - 8.0
Frequency Range, IF
DC - 3.0
Conversion Loss
7
Noise Figure (SSB)
7
LO to RF Isolation
30 40
LO to IF Isolation
35 42
IP3 (Input)
13 17
IP2 (Input)
40 55
1 dB Gain Compression (Input)
6 10
* Unless otherwise noted, all measurements performed as downconverter, IF = 100 MHz
Max.
9
9
Units
GHz
GHz
dB
dB
dB
dB
dBm
dBm
dBm
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
1 page  
v02.0802
MICROWAVE CORPORATION
HMC129
GaAs MMIC DOUBLE-BALANCED
MIXER, 4 - 8 GHz
Outline Drawing
5
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. BOND PADS ARE .004” SQUARE
3. TYPICAL BOND PAD SPACING CENTER TO CENTER
IS .006” EXCEPT AS SHOWN
4. DIE THICKNESS = .004” [.100 MM]
5. BACKSIDE METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. BOND PAD METALIZATION: GOLD
Pad Descriptions
Pad Number
Function
1 IF
Description
This pin is DC coupled. For applications not requiring opera-
tion to DC, this port should be DC blocked externally using a
series capacitor whose value has been chosen to pass the
necessary IF frequency range. For operation to DC this pin
must not source or sink more than 2mA of current or die non-
function and possible die failure will result.
2 RF
This pin is DC coupled and matched to 50 Ohm
from 4 to 8 GHz.
Interface Schematic
3 LO
This pin is DC coupled and matched to 50 Ohm
from 4 to 8 GHz.
5 - 12
GND
The backside of the die must connect to RF ground.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet HMC129.PDF ] | |
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