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PDF HMC207S8 Data sheet ( Hoja de datos )

Número de pieza HMC207S8
Descripción GaAs MMIC SMT DOUBLEBALANCED MIXER/ 0.7 - 2.0 GHz
Fabricantes Hittite Microwave Corporation 
Logotipo Hittite Microwave Corporation Logotipo



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v01.0801
MICROWAVE CORPORATION
HMC207S8
GaAs MMIC SMT DOUBLE-
BALANCED MIXER, 0.7 - 2.0 GHz
Typical Applications
The HMC207S8 is ideal for:
• Base Stations
• Cable Modems
• Portable Wireless
12
Functional Diagram
Features
Conversion Loss: 9.0 dB
LO / IF Isolation: 45 dB
LO / RF Isolation: 40 dB
IP3 (Input): +17 dBm
General Description
The HMC207S8 is a miniature double-balanced
mixer in an 8 lead plastic surface mount Small
Outline IC (SOIC) package. This passive MMIC
mixer is constructed of GaAs Schottky diodes and
novel planar transformer baluns on the chip. The
device can be used as an upconverter, down-
converter, biphase modulator (de)modulator, or
phase comparator. The consistent MMIC perfor-
mance will improve system operation and assure
regulatory compliance. The high LO suppression
of 45 to 50 dB yields excellent carrier suppres-
sion for modulator applications.
Electrical Specifications, T = +25° C, As a Function of LO Drive
A
Parameter
LO = +13 dBm
IF = 70 MHz
Min. Typ. Max.
LO = +10 dBm
IF = 70 MHz
Min. Typ.
Frequency Range, RF & LO
0.7 - 2.0
0.8 - 1.2
Frequency Range, IF
DC - 0.3
DC - 0.3
Conversion Loss
9 10.5
7.5
Noise Figure (SSB)
9 10.5
7.5
LO to RF Isolation
32 40
40 45
LO to IF Isolation
38 45
40 45
RF to IF Isolation
17 23
18 22
IP3 (Input)
14 17
12 15
1 dB Gain Compression (Input)
8 11
7 10
Max.
10
10
Units
GHz
GHz
dB
dB
dB
dB
dB
dBm
dBm
12 - 36
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com

1 page




HMC207S8 pdf
v01.0801
MICROWAVE CORPORATION
HMC207S8
GaAs MMIC SMT DOUBLE-
BALANCED MIXER, 0.7 - 2.0 GHz
Evaluation PCB
12
List of Material
Item
Description
J1 - J3
PC Mount SMA RF Connector
U1 HMC207S8 Mixer
PCB*
101783 Evaluation Board
* Circuit Board Material: Rogers 4350
The circuit board used in the final application should
use RF circuit design techniques. Signal lines should
have 50 ohm impedance while the package ground
leads should be connected directly to the ground
plane similar to that shown. A sufficient number of VIA
holes should be used to connect the top and bottom
ground planes. The evaluation circuit board shown is
available from Hittite upon request.
12 - 40
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com

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