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PDF HMC240 Data sheet ( Hoja de datos )
| Número de pieza | HMC240 | |
| Descripción | GaAs MMIC SPDT SWITCH DC - 4.0 GHz | |
| Fabricantes | Hittite Microwave Corporation | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de HMC240 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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v00.0403
MICROWAVE CORPORATION
Typical Applications
The HMC240 is ideal for:
• Telecom Infrastructure
• Microwave Radio & VSAT
• Military & Space
• Test Instrumentation
Functional Diagram
7
HMC240
GaAs MMIC SPDT SWITCH
DC - 4.0 GHz
Features
Broadband Performance: DC - 4.0 GHz
Low Insertion Loss: 0.5 dB @ 2.0 GHz
High IIP3: +48 dBm
Small Size: 0.70 mm x 0.70 mm x 0.13 mm
General Description
The HMC240 is a low cost GaAs MESFET SPDT
switch chip. Covering DC to 4.0 GHz, this switch
offers high isolation and low insertion loss. RF1
and RF2 are reflective shorts when “off”. The
switch can operate using either two negative con-
trol logic inputs of -5/0V or two positive control
voltage logic inputs of 0/+5V. All data is tested
with the chip in a 50 Ohm test fixture connected
via 0.025 mm (1 mil) diameter wire bonds of 0.31
mm (12 mils) length.
Pads 3 & 7 are alternate A & B Control Inputs.
Electrical Specifications, TA = +25° C,
With 0/-5V Control or +5/0V Control, 50 Ohm System
Parameter
Insertion Loss
Isolation
Return Loss
Input Power for 1 dB Compression
Input Third Order Intercept
(Two-Tone Input Power= +7 dBm Each Tone)
Switching Characteristics
tRISE, tFALL (10/90% RF)
tON, tOFF (50% CTL to 10/90% RF)
“On State”
Frequency
DC - 1.0 GHz
DC - 2.0 GHz
DC - 3.0 GHz
DC - 4.0 GHz
DC - 4.0 GHz
DC - 1.0 GHz
DC - 2.0 GHz
DC - 3.0 GHz
DC - 4.0 GHz
0.5 - 1.0 GHz
0.5 - 4.0 GHz
0.5 - 1.0 GHz
0.5 - 4.0 GHz
DC - 4.0 GHz
Min.
Typ.
Max.
Units
0.4 0.7 dB
0.5 0.8 dB
0.6 0.9 dB
0.9 1.4 dB
24 28
dB
22 dB
16 dB
14 dB
11 dB
25 30
23 29
dBm
dBm
43 48
40 45
dBm
dBm
3 ns
10 ns
7-8
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
1 page  
v00.0403
MICROWAVE CORPORATION
Assembly Diagram
HMC240
GaAs MMIC SPDT SWITCH
DC - 4.0 GHz
7
Handling Precautions
Follow these precautions to avoid permanent damage.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems.
Static Sensitivity: Follow ESD precautions to protect against > ± 250V ESD strikes.
Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize
inductive pick-up.
General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the
chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with electrically conductive epoxy. The mounting surface should be clean and
flat.
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the
perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of
150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum
level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or
substrate. All bonds should be as short as possible <0.31mm (12 mils).
7 - 12
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet HMC240.PDF ] | |
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