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PDF HMC318MS8G Data sheet ( Hoja de datos )
| Número de pieza | HMC318MS8G | |
| Descripción | GaAs MMIC LOW NOISE AMPLIFIER with AGC/ 5.0 - 6.0 GHz | |
| Fabricantes | Hittite Microwave Corporation | |
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v00.0900 HMC318MS8G
MICROWAVE CORPORATION
GaAs MMIC LOW NOISE AMPLIFIER
with AGC, 5.0 - 6.0 GHz
8 Typical Applications
The HMC318MS8G is ideal for:
• UNII
• HiperLAN
Functional Diagram
Features
LNA with 18 dB Gain Control
+3V Operation
Low Noise Figure: 2.5 dB
No External Components
Ultra Small 8 Lead MSOP:
14.8mm2 x 1mm High
General Description
The HMC318MS8G is a surface mount low cost
C-band variable gain low noise amplifier (VGLNA)
that serves the full UNII and HiperLAN bands.
The HMC318MS8G operates using a single posi-
tive supply that can be set between +3V or +5V.
When a control voltage of 0V to +3V is applied,
the gain of the amplifier will decrease while main-
taining excellent return loss performance. A max-
imum gain of 9 dB is achieved when VCTL is set
to 0V and a minimum gain of -9 dB is achieved
when Vctl is set to +3V.
Electrical Specifications, TA = +25° C, Vdd = +3V
Parameter*
Min. Typ.
Frequency Range
5.0 - 6.0
Gain
69
Gain Variation over Temperature
0.03
Gain Control Range
11 18
Noise Figure
2.5
Input Return Loss
6 12
Output Return Loss
7 13
Output Power for 1 dB Compression (P1dB)
-1 2
Output Third Order Intercept (OIP3)
10 13
Supply Current (Idd)
6
* Specifications refer to the maximum gain state (Vctl = 0V) unless otherwise noted.
Max.
12
0.04
23
4.0
10
Units
GHz
dB
dB/°C
dB
dB
dB
dB
dBm
dBm
mA
8 - 86
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
1 page  
MICROWAVE CORPORATION
v00.0900
HMC318MS8G
GaAs MMIC LOW NOISE AMPLIFIER
with AGC, 5.0 - 6.0 GHz
8 Evaluation PCB
List of Material
Item
Description
J1, J2
PC Mount SMA Connector
J3, J4
DC Pin
U1 HMC318MS8G Amplifier
PCB*
Evaluation PCB 1.6” x 1.5”
*Circuit Board Material: Roger 4350
The circuit board used in the final application should use
RF circuit design techniques. Signal lines should have
50 ohm impedance while the package ground leads and
exposed paddle should be connected directly to the ground
plane similar to that shown. A sufficient number of via holes
should be used to connect the top and bottom ground
planes. The evaluation circuit board shown is available from
Hittite upon request.
8 - 90
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet HMC318MS8G.PDF ] | |
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