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PDF HMC370LP4 Data sheet ( Hoja de datos )
| Número de pieza | HMC370LP4 | |
| Descripción | SMT GaAs HBT MMIC x4 ACTIVE FREQUENCY MULTIPLIER | |
| Fabricantes | Hittite Microwave Corporation | |
| Logotipo |  |
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HMC370LP4 / 370LP4E
v04.0110
SMT GaAs HBT MMIC x4 ACTIVE
FREQUENCY MULTIPLIER, 14.4 - 16.4 GHz OUTPUT
Typical Applications
7 The HMC370LP4(E) is ideal for:
• Point-to-Point & VSAT Radios
• Fiber Optic
• Military
Functional Diagram
Features
Output Power: 0 dBm
Sub-Harmonic Suppression: >22 dBc
SSB Phase Noise: -140 dBc/Hz
Single Supply: +5V @ 55 mA
24 Lead 4x4 mm SMT Package: 16 mm2
General Description
The HMC370LP4(E) is an active miniature x4 fre-
quency multiplier utilizing InGaP GaAs HBT
technology in a 4x4 mm leadless surface mount
package. Power output is 0 dBm typical from a
5V supply voltage and varies little vs. input power,
temperature and supply voltage. Suppression of
undesired fundamental and sub-harmonics is >22
dBc typical with respect to output signal level. The
low additive SSB phase noise of -140 dBc/Hz at
100 kHz offset helps the user maintain good sys-
tem noise performance. The HMC370LP4(E) are ideal
for use in LO multiplier chains allowing reduced parts
count vs. traditional approaches.
Electrical Specifications, TA = +25° C, Vcc = 5V
Parameter
Frequency Range, Input
Frequency Range, Output
Input Power Range
Output Power
Sub-Harmonic Suppression
Input Return Loss
Output Return Loss
SSB Phase Noise (100 kHz Offset)
Supply Current (Icc)
Pin = 0 dBm
Min. Typ. Max.
3.6 - 4.1
14.4 - 16.4
-15 +5
-4 0
22
18
7
-140
55
73
Units
GHz
GHz
dBm
dBm
dBc
dB
dB
dBc/Hz
mA
7 - 46
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1 page  
HMC370LP4 / 370LP4E
v03.0907
SMT GaAs HBT MMIC x4 ACTIVE
FREQUENCY MULTIPLIER, 14.4 - 16.4 GHz OUTPUT
Absolute Maximum Ratings
RF Input (Vcc = +5V)
Vcc
Channel Temperature
Continuous Pdiss (T=85 °C)
(derate 8.1 mW/°C above 85 °C)
Thermal Resistance (R )
th
(junction to ground paddle)
Storage Temperature
Operating Temperature
+20 dBm
+5.5V
135 °C
530 mW
123.6 °C/W
-65 to +150 °C
-40 to +85 °C
Typical Supply Current vs. Vcc
Vcc (V)
Icc (mA)
4.5 54
5.0 55
5.5 57
Note: Multiplier will operate over full voltage range shown
above.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
7
Outline Drawing
Package Information
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
LAND PATTERN.
Part Number
HMC370LP4
Package Body Material
Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
HMC370LP4E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
MSL Rating
MSL1 [1]
MSL1 [2]
Package Marking [3]
H370
XXXX
H370
XXXX
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7 - 49
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet HMC370LP4.PDF ] | |
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