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PDF SBD835L Data sheet ( Hoja de datos )
| Número de pieza | SBD835L | |
| Descripción | 8A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER | |
| Fabricantes | Diodes Incorporated | |
| Logotipo |  |
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SBD835L
8A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
Features
· Guard Ring Die Construction for
Transient Protection
· Low Power Loss, High Efficiency
· High Surge Capability
· High Current Capability and Very Low
Forward Voltage Drop
· Surge Overload Rating to 150A Peak
· Plastic Material: UL Flammability
Classification Rating 94V-0
Mechanical Data
· Case: DPAK Molded Plastic
· Terminals: Solderable per MIL-STD-202,
Method 208
· Polarity: See Diagram
· Marking: Type Number
· Weight: 0.4 grams (approx.)
AE
P
4
DPAK
Dim Min Max
G A 6.3 6.7
B ¾ 10
H C 0.3 0.8
D 2.3 Nominal
B J E 2.1 2.5
123
G 0.4 0.6
H 1.2 1.6
M J 5.3 5.7
K 0.5 Nominal
D K L 1.3 1.8
CL
M 1.0 ¾
P 5.1 5.5
PIN 1
PIN 3
PIN 4
All Dimensions in mm
Note:
Pins 1 & 3 must be electrically
connected at the printed circuit board.
Maximum Ratings and Electrical Characteristics @ TA = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
@ TC = 88°C
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
(JEDEC Method)
Forward Voltage (Note 2)
Voltage Rate of Change
@ IF = 8A, Tj = 25°C
@ IF = 8A, Tj = 125°C
Peak Reverse Current
at Rated DC Blocking Voltage
Typical Junction Capacitance (Note 3)
@ TC = 25°C
@ TC = 100°C
Typical Thermal Resistance Junction to Case (Note 1)
Typical Thermal Resistance Junction to Ambient
Operating Temperature Range
Storage Temperature Range
Symbol
VRRM
VRWM
VR
VR(RMS)
IO
IFSM
VFM
dv/dt
IRM
CJ
RqJC
RqJA
Tj
TSTG
SBD835L
35
25
8
150
0.51
0.41
10,000
1.4
35
300
6
80
-65 to +125
-65 to +150
Unit
V
V
A
A
V
V/ms
mA
pF
°C/W
°C/W
°C
°C
Notes:
1. Thermal resistance: junction to case, unit mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pad as heat sink.
2. 300ms pulse width, 2% duty cycle.
3. f = 1 MHz, VR = 5VDC.
DS30202 Rev. E-1
1 of 2
SBD835L
1 page | ||
| Páginas | Total 2 Páginas | |
| PDF Descargar | [ Datasheet SBD835L.PDF ] | |
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