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PDF SAA6581 Data sheet ( Hoja de datos )
| Número de pieza | SAA6581 | |
| Descripción | RDS/RBDS demodulator | |
| Fabricantes | NXP Semiconductors | |
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INTEGRATED CIRCUITS
DATA SHEET
SAA6581T
RDS/RBDS demodulator
Product specification
File under Integrated Circuits, IC01
2001 May 07
1 page  
Philips Semiconductors
RDS/RBDS demodulator
Product specification
SAA6581T
Table 1 Control pin SYNC
SYNC
LOW
HIGH
ARI CLAMPING
internal ARI clamping disabled
ARI clamping allowed to be logged
Table 2 Control pins TCON and MODE
TCON
HIGH
HIGH
MODE
LOW
HIGH
OSCILLATOR FREQUENCY
4.332 MHz
8.664 MHz
SIGNAL QUALITY DETECTION
Output QUAL indicates the safety of the regenerated RDS
data (HIGH = ‘good’ data; LOW = ‘unsafe’ data).
Oscillator and system clock generator
For good performance of the bandpass and demodulator
stages, the demodulator requires a crystal oscillator with a
frequency of 4.332 or 8.664 MHz. The demodulator can
operate with either frequency (see Table 2), so that a radio
set with a microcontroller can run, in this case, with one
crystal only. The demodulator oscillator can drive the
microcontroller, or vice versa.
The clock generator generates the internal 4.332 MHz
system clock and timing signal derivatives.
Power supply and internal reset
The demodulator has separate power supply inputs for the
digital and analog parts of the device. For the analog
functions an additional reference voltage (1⁄2VDDA) is
internally generated and available via the output pin Vref.
The demodulator requires a defined reset condition. The
demodulator generates automatically a reset signal after
the power supply VDDA is switched on, or at a voltage-drop.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
VDD
Vn
Ii
Ilu(prot)
Tamb
Tstg
Ves
PARAMETER
CONDITIONS
MIN.
supply voltage
voltage at pins 1 to 4, 7 to 10, and
13 to 16 with respect to pins 6 and 11
input current at pins 1 to 5, 7 to 11 and
13 to 16
latch-up protection current in pulsed
mode
ambient temperature
storage temperature
electrostatic handling voltage
pins 5 and 12 are
connected to VDD
pins 6 and 11 are
connected to ground
Tamb = −40 to +85 °C with
voltage limiting −2 to +10 V
Tamb = 25 °C with voltage
limiting −2 to +12 V
Tamb = −40 to +85 °C
without voltage limiting
note 1
note 2
0
−0.5
−10
−100
−200
−10
−40
−65
−4 000
−500
MAX.
UNIT
6.5 V
VDD + 0.5 ≤ 6.5 V
+10 mA
+100
mA
+200
mA
+10 mA
+85
+150
+4 000
+500
°C
°C
V
V
Notes
1. Human body model (equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor).
2. Machine model (equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor and 0.75 µH inductance).
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
Rth(j-a)
thermal resistance from junction to ambient in free air
VALUE
104
UNIT
K/W
2001 May 07
5
5 Page 
Philips Semiconductors
RDS/RBDS demodulator
Product specification
SAA6581T
Suitability of surface mount IC packages for wave and reflow soldering methods
PACKAGE
BGA, HBGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
PLCC(3), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
SOLDERING METHOD
WAVE
REFLOW(1)
not suitable
suitable
not suitable(2)
suitable
suitable
suitable
not recommended(3)(4) suitable
not recommended(5) suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2001 May 07
11
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet SAA6581.PDF ] | |
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