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PDF 74LCXH2245 Data sheet ( Hoja de datos )

Número de pieza 74LCXH2245
Descripción Low Voltage Bidirectional Transceiver with Bushold and 26 Series Resistors in B Outputs
Fabricantes Fairchild Semiconductor 
Logotipo Fairchild Semiconductor Logotipo



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October 2000
Revised September 2001
74LCXH2245
Low Voltage Bidirectional Transceiver with Bushold
and 26Series Resistors in B Outputs
General Description
The LCXH2245 contains eight non-inverting bidirectional
buffers with 3-STATE outputs and is intended for bus ori-
ented applications. The device is designed for low voltage
(2.5V and 3.3V) VCC applications. The T/R input deter-
mines the direction of data flow through the device. The OE
input disables both the A and B ports by placing them in a
high impedance state. The 26series resistor in the B Port
output helps reduce output overshoot and undershoot.
The LCXH2245 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing CMOS low power dissipation.
The LCXH2245 data inputs include active bushold circuitry,
eliminating the need for external pull-up resistors to hold
unused or floating data inputs at a valid logic level.
Features
s 5V tolerant control inputs
s 2.3V–3.6V VCC specifications provided
s Bushold on inputs eliminates the need for external
pull-up/pull-down resistors
s 7.0 ns tPD max (VCC = 3.3V), 10 µA ICC max
s Power down high impedance outputs
s ±12 mA output drive B Port (VCC = 3.0V)
s Implements patented noise/EMI reduction circuitry
s Latch-up performance exceeds 500 mA
s Equivalent 26series resistor on B Port outputs
s ESD performance:
Human body model > 2000V
Machine model > 200V
Ordering Code:
Order Number Package Number
Package Description
74LCXH2245WM
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LCXH2245SJ
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LCXH2245MSA
MSA20
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
74LCXH2245MTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter Xto the ordering code.
Logic Symbol
Connection Diagram
Pin Descriptions
Pin Names
OE
T/R
A0A7
B0B7
Description
Output Enable Input
Transmit/Receive Input
Side A Inputs or 3-STATE Outputs (Bushold)
Side B Inputs or 3-STATE Outputs (Bushold)
GTOis a trademark of Fairchild Semiconductor Corporation.
© 2001 Fairchild Semiconductor Corporation DS500409
www.fairchildsemi.com

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74LCXH2245 pdf
Dynamic Switching Characteristics
Symbol
Parameter
VOLP
VOLV
Quiet Output Dynamic Peak VOL
B to A
Quiet Output Dynamic Peak VOL
A to B
Quiet Output Dynamic Valley VOL
B to A
Quiet Output Dynamic Valley VOL
A to B
Capacitance
Symbol
CIN
CI/O
CPD
Parameter
Input Capacitance
Input/Output Capacitance
Power Dissipation Capacitance
Conditions
CL = 30 pF, VIH = 2.5V, VIL = 0V
CL = 50 pF, VIH =3.3V, VIL = 0V
CL = 30 pF, VIH = 2.5V, VIL = 0V
CL = 50 pF, VIH = 3.3V, VIL = 0V
CL = 30 pF, VIH = 2.5V, V IL = 0V
CL = 50 pF, VIH = 3.3V, VIL = 0V
CL = 30 pF, VIH = 2.5V, V IL = 0V
CL = 50 pF, VIH = 3.3V, VIL = 0V
Conditions
VCC = Open, VI = 0V or VCC
VCC = 3.3V, VI = 0V or VCC
VCC = 3.3V, VI = 0V or VCC, f = 10 MHz
VCC
TA = 25°C
Units
(V) Typical
2.5 0.6
3.3 0.8
V
2.5 0.4
3.3 0.5
V
2.5 0.6
3.3 0.8
V
2.5 0.4
3.3 0.5
V
Typical
7
8
25
Units
pF
pF
pF
5 www.fairchildsemi.com

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74LCXH2245 arduino
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC20
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
www.fairchildsemi.com
11 www.fairchildsemi.com

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