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74LVT16245B PDF даташит

Спецификация 74LVT16245B изготовлена ​​​​«NXP Semiconductors» и имеет функцию, называемую «3.3 V 16-bit transceiver».

Детали детали

Номер произв 74LVT16245B
Описание 3.3 V 16-bit transceiver
Производители NXP Semiconductors
логотип NXP Semiconductors логотип 

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74LVT16245B Даташит, Описание, Даташиты
74LVT16245B; 74LVTH16245B
3.3 V 16-bit transceiver; 3-state
Rev. 10 — 1 March 2012
Product data sheet
1. General description
The 74LVT16245B; 74LVTH16245B is a high-performance BiCMOS product designed for
VCC operation at 3.3 V.
This device is a 16-bit transceiver featuring non-inverting 3-state bus compatible outputs
in both send and receive directions. The control function implementation minimizes
external timing requirements. The device features an output enable input (nOE) for easy
cascading and a direction input (nDIR) for direction control.
2. Features and benefits
16-bit bidirectional bus interface
3-state buffers
Output capability: +64 mA and 32 mA
TTL input and output switching levels
Input and output interface capability to systems at 5 V supply
Bus hold data inputs eliminate need for external pull-up resistors to hold unused inputs
Live insertion and extraction permitted
Power-up 3-state
No bus current loading when output is tied to 5 V bus
Latch-up protection:
JESD78B Class II exceeds 500 mA
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V









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74LVT16245B Даташит, Описание, Даташиты
NXP Semiconductors
74LVT16245B; 74LVTH16245B
3.3 V 16-bit transceiver; 3-state
3. Ordering information
Table 1. Ordering information
Type number
Package
Temperature range Name
74LVT16245BDL 40 C to +85 C SSOP48
74LVTH16245BDL
74LVT16245BDGG 40 C to +85 C TSSOP48
74LVTH16245BDGG
74LVT16245BEV 40 C to +85 C VFBGA56
74LVT16245BBX 40 C to +125 C
74LVTH16245BBX
HXQFN60
Description
plastic shrink small outline package; 48 leads;
body width 7.5 mm
Version
SOT370-1
plastic thin shrink small outline package; 48 leads; SOT362-1
body width 6.1 mm
plastic very thin fine-pitch ball grid array package; SOT702-1
56 balls; body 4.5 7 0.65 mm
plastic compatible thermal enhanced extremely
thin quad flat package; no leads; 60 terminals;
body 4 6 0.5 mm
SOT1134-2
4. Functional diagram
1DIR
1A0
1A1
1A2
1A3
1A4
1A5
1A6
1A7
2DIR
1OE
1B0
1B1
1B2
1B3
1B4
1B5
1B6
1B7
2A0
2A1
2A2
2A3
2A4
2A5
2A6
2A7
Pin numbers are shown for SSOP48 and TSSOP48 packages only.
Fig 1. Logic symbol
2OE
2B0
2B1
2B2
2B3
2B4
2B5
2B6
2B7
001aaa789
74LVT_LVTH16245B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 1 March 2012
© NXP B.V. 2012. All rights reserved.
2 of 19









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74LVT16245B Даташит, Описание, Даташиты
NXP Semiconductors
74LVT16245B; 74LVTH16245B
3.3 V 16-bit transceiver; 3-state
1OE 48
1DIR 1
25
2OE
2DIR 24
1A0 47
1A1 46
1A2 44
1A3 43
1A4 41
40
1A5
1A6 38
1A7 37
36
2A0
2A1 35
2A2 33
32
2A3
30
2A4
29
2A5
27
2A6
26
2A7
G3
3EN1 [BA]
3EN2 [AB]
G6
6EN4 [BA]
6EN5 [AB]
1
2
4
5
Pin numbers are shown for SSOP48 and TSSOP48 packages only.
Fig 2. IEC logic symbol
2 1B0
3 1B1
5 1B2
6 1B3
8 1B4
9 1B5
11 1B6
12 1B7
13 2B0
14 2B1
16 2B2
17 2B3
19
2B4
20 2B5
22 2B6
23 2B7
mna709
74LVT_LVTH16245B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 1 March 2012
© NXP B.V. 2012. All rights reserved.
3 of 19










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