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PDF 74LVTH16244MEA Data sheet ( Hoja de datos )

Número de pieza 74LVTH16244MEA
Descripción Low Voltage16-Bit Buffer/Line Driver with 3-STATE Outputs
Fabricantes Fairchild Semiconductor 
Logotipo Fairchild Semiconductor Logotipo



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No Preview Available ! 74LVTH16244MEA Hoja de datos, Descripción, Manual

March 1999
Revised April 1999
74LVT16244 • 74LVTH16244
Low Voltage16-Bit Buffer/Line Driver
with 3-STATE Outputs
General Description
The LVT16244 and LVTH16244 contain sixteen non-invert-
ing buffers with 3-STATE outputs designed to be employed
as a memory and address driver, clock driver, or bus ori-
ented transmitter/receiver. The device is nibble controlled.
Individual 3-STATE control inputs can be shorted together
for 8-bit or 16-bit operation.
The LVTH16244 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These buffers and line drivers are designed for low-voltage
(3.3V) VCC applications, but with the capability to provide a
TTL interface to a 5V environment. The LVT16244 and
LVTH16244 are fabricated with an advanced BiCMOS
technology to achieve high speed operation similar to 5V
ABT while maintaining a low power dissipation
Features
s Input and output interface capability to systems at 5V
VCC
s Bushold data inputs eliminate the need for external pull-
up resistors to hold unused inputs (74LVTH16244), also
available without bushold feature (74LVT16244).
s Live insertion/extraction permitted
s Power Up/Down high impedance provides glitch-free
bus loading
s Outputs source/sink 32 mA/+64 mA
s Functionally compatible with the 74 series 16244
s Latch-up performance exceeds 500 mA
Ordering Code:
Order Number
Package
Number
Package Description
74LVT16244MEA
MS48A
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300” Wide
74LVT16244MTD
MTD48
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
74LVTH16244MEA
MS48A
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300” Wide
74LVTH16244MTD
MTD48
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Logic Symbol
© 1999 Fairchild Semiconductor Corporation DS500151
Print form created on April 12, 1999 2:43 pm
www.fairchildsemi.com

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74LVTH16244MEA pdf
Physical Dimensions inches (millimeters) unless otherwise noted
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300” Wide
Package Number MS48A
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Package Number MTD48
5 www.fairchildsemi.com

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