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PDF NTR1P02LT3 Data sheet ( Hoja de datos )
| Número de pieza | NTR1P02LT3 | |
| Descripción | Power MOSFET ( Transistor ) | |
| Fabricantes | ON Semiconductor | |
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NTR1P02LT1
Power MOSFET
−20 V, −1.3 A, P−Channel
SOT−23 Package
These miniature surface mount MOSFETs low RDS(on) assure
minimal power loss and conserve energy, making these devices ideal
for use in space sensitive power management circuitry. Typical
applications are dc−dc converters and power management in portable
and battery−powered products such as computers, printers, PCMCIA
cards, cellular and cordless telephones.
Features
• Low RDS(on) Provides Higher Efficiency and Extends Battery Life
• Miniature SOT−23 Surface Mount Package Saves Board Space
• Pb−Free Package is Available
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value
Unit
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Drain Current
− Continuous @ TA = 25°C
− Pulsed Drain Current (tp ≤ 10 ms)
Total Power Dissipation @ TA = 25°C
Operating and Storage Temperature Range
VDSS −20 V
VGS ±12 V
ID
IDM
PD
TJ, Tstg
−1.3 A
−4.0 A
400
− 55 to
150
mW
°C
Thermal Resistance − Junction−to−Ambient
Maximum Lead Temperature for Soldering
Purposes, (1/8″ from case for 10 s)
RqJA
TL
300 °C/W
260 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
http://onsemi.com
V(BR)DSS
−20 V
RDS(on) MAX
220 mW
P−Channel
D
ID MAX
−1.3 A
G
S
3
1
2
SOT−23
CASE 318
STYLE 21
MARKING DIAGRAM/
PIN ASSIGNMENT
3
Drain
PO2W
1
Gate
2
Source
PO2 = Specific Device Code
W = Work Week
ORDERING INFORMATION
Device
Package
NTR1P02LT1 SOT−23
NTR1P02LT1G SOT−23
(Pb−Free)
Shipping†
3000 Tape & Reel
3000 Tape & Reel
NTR1P02LT3 SOT−23 10,000 Tape & Reel
NTR1P02LT3G SOT−23 10,000 Tape & Reel
(Pb−Free)
© Semiconductor Components Industries, LLC, 2004
July, 2004 − Rev. 5
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1 Publication Order Number:
NTR1P02LT1/D
1 page  
NTR1P02LT1
V
D
A
L
3
12
BS
G
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−09
ISSUE AJ
C
H
KJ
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIUMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 318−01, −02, AND −06 OBSOLETE, NEW
STANDARD 318−09.
INCHES
DIM MIN
MAX
A 0.1102 0.1197
B 0.0472 0.0551
C 0.0385 0.0498
D 0.0140 0.0200
G 0.0670 0.0826
H 0.0040 0.0098
J 0.0034 0.0070
K 0.0180 0.0236
L 0.0350 0.0401
S 0.0830 0.0984
V 0.0177 0.0236
MILLIMETERS
MIN MAX
2.80 3.04
1.20 1.40
0.99 1.26
0.36 0.50
1.70 2.10
0.10 0.25
0.085 0.177
0.45 0.60
0.89 1.02
2.10 2.50
0.45 0.60
STYLE 21:
PIN 1. GATE
2. SOURCE
3. DRAIN
0.9
0.035
2.0
0.079
0.8
0.031
ǒ ǓSCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet NTR1P02LT3.PDF ] | |
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