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PDF OPA548 Data sheet ( Hoja de datos )
| Número de pieza | OPA548 | |
| Descripción | High-Voltage / High-Current OPERATIONAL AMPLIFIER | |
| Fabricantes | Burr-Brown | |
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® OPA548
OPA548
OPA548
www.burr-brown.com/databook/OPA548.html
High-Voltage, High-Current
OPERATIONAL AMPLIFIER
FEATURES
q WIDE SUPPLY RANGE
Single Supply: +8V to +60V
Dual Supply: ±4V to ±30V
q HIGH OUTPUT CURRENT:
3A Continuous
5A Peak
q WIDE OUTPUT VOLTAGE SWING
q FULLY PROTECTED:
Thermal Shutdown
Adjustable Current Limit
q OUTPUT DISABLE CONTROL
q THERMAL SHUTDOWN INDICATOR
q HIGH SLEW RATE: 10V/µs
q LOW QUIESCENT CURRENT
q PACKAGES:
7-Lead TO-220
7-Lead DDPAK Surface-Mount
APPLICATIONS
q VALVE, ACTUATOR DRIVER
q SYNCHRO, SERVO DRIVER
q POWER SUPPLIES
q TEST EQUIPMENT
q TRANSDUCER EXCITATION
q AUDIO AMPLIFIER
DESCRIPTION
The OPA548 is a low cost, high-voltage/high-current
operational amplifier ideal for driving a wide variety
of loads. A laser-trimmed monolithic integrated cir-
cuit provides excellent low-level signal accuracy and
high output voltage and current.
The OPA548 operates from either single or dual sup-
plies for design flexibility. In single supply operation,
the input common-mode range extends below ground.
The OPA548 is internally protected against over-
temperature conditions and current overloads. In addi-
tion, the OPA548 was designed to provide an accurate,
user-selected current limit. Unlike other designs which
use a “power” resistor in series with the output current
path, the OPA548 senses the load indirectly. This
allows the current limit to be adjusted from 0 to 5A
with a resistor/potentiometer or controlled digitally
with a voltage-out or current-out DAC.
The Enable/Status (E/S) pin provides two functions.
An input on the pin not only disables the output stage
to effectively disconnect the load but also reduces the
quiescent current to conserve power. The E/S pin
output can be monitored to determine if the OPA548
is in thermal shutdown.
The OPA548 is available in an industry-standard
7-lead staggered TO-220 package and a 7-lead DDPAK
surface-mount plastic power package. The copper tab
allows easy mounting to a heat sink or circuit board
for excellent thermal performance. It is specified for
operation over the extended industrial temperature
range, –40°C to +85°C. A SPICE macromodel is
V+ available for design analysis.
VI–N
OPA548
VO
VI+N ILIM
RCL (1/4W Resistor)
E/S
V–
RCL sets the current limit
value from 0 to 5A.
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111
Internet: http://www.burr-brown.com/ • FAXLine: (800) 548-6133 (US/Canada Only) • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
©1997 Burr-Brown Corporation
PDS-11389B
OPA548Printed in U.S.A. October, 1997
®
1 page  
TYPICAL PERFORMANCE CURVES (CONT)
At TCASE = +25°C, VS = ±30V and E/S pin open, unless otherwise noted.
COMMON-MODE REJECTION vs FREQUENCY
100
80
60
40
20
0
10 100 1k 10k 100k 1M
Frequency (Hz)
100
80
60
40
20
0
10
POWER SUPPLY REJECTION
vs FREQUENCY
–PSRR
+PSRR
100 1k 10k 100k 1M
Frequency (Hz)
VOLTAGE NOISE DENSITY vs FREQUENCY
500
400
300
200
100
0
1 10 100 1k 10k 100k 1M
Frequency (Hz)
OPEN-LOOP GAIN, COMMON-MODE REJECTION,
AND POWER SUPPLY REJECTION vs TEMPERATURE
100 110
AOL
95 105
90 100
PSRR
85
CMRR
95
80
–75 –50 –25
0
90
25 50 75 100 125
Temperature (°C)
1.25
1
GAIN-BANDWIDTH PRODUCT AND
SLEW RATE vs TEMPERATURE
GBW
13
12
0.75
0.5
SR+
11
10
0.25
SR–
9
0
–75 –50 –25
0
8
25 50 75 100 125
Temperature (°C)
TOTAL HARMONIC DISTORTION+NOISE
vs FREQUENCY
1
G = +3
RL = 8Ω
20W
10W
0.1
1W
0.1W
0.01
0.001
20
100 1k
Frequency (Hz)
10k 20k
®
5 OPA548
5 Page 
HEAT SINKING
Most applications require a heat sink to assure that the
maximum operating junction temperature (125°C) is not
exceeded. In addition, the junction temperature should be
kept as low as possible for increased reliability. Junction
temperature can be determined according to the equation:
TJ = TA + PDθJA
(1)
where, θJA = θJC + θCH + θHA
(2)
TJ = Junction Temperature (°C)
TA = Ambient Temperature (°C)
PD = Power Dissipated (W)
θJC = Junction-to-Case Thermal Resistance (°C/W)
θCH = Case-to-Heat Sink Thermal Resistance (°C/W)
θHA = Heat Sink-to-Ambient Thermal Resistance (°C/W)
θJA = Junction-to-Air Thermal Resistance (°C/W)
Figure 7 shows maximum power dissipation versus ambient
temperature with and without the use of a heat sink. Using
a heat sink significantly increases the maximum power
dissipation at a given ambient temperature as shown.
The difficulty in selecting the heat sink required lies in
determining the power dissipated by the OPA548. For dc
output into a purely resistive load, power dissipation is
simply the load current times the voltage developed across
the conducting output transistor, PD = IL(Vs–VO). Other
loads are not as simple. Consult Application Bulletin AB-
039 for further insight on calculating power dissipation.
Once power dissipation for an application is known, the
proper heat sink can be selected.
MAXIMUM POWER DISSIPATION
vs AMBIENT TEMPERATURE
10
TO-220 with Thermalloy PD = (TJ (max) – TA) /θ JA
6030B Heat Sink
TJ (max) = 150°C
8 θJA = 16.7°C/W
With infinite heat sink
6
DDPAK
4
(θ3JAin=2
26°C/W
one oz
copper mounting pad)
(θJA = 2.5°C/W),
max PD = 50W at TA = 25°C.
2
DDPAK or TO-220
θJA = 65°C/W (no heat sink)
0
0 25 50
75
Ambient Temperature (°C)
100
125
Combining equations (1) and (2) gives:
TJ = TA + PD(θJC + θCH + θHA)
(3)
TJ, TA, and PD are given. θJC is provided in the specification
table, 2.5°C/W (dc). θCH can be obtained from the heat sink
manufacturer. Its value depends on heat sink size, area, and
material used. Semiconductor package type, mounting screw
torque, insulating material used (if any), and thermal
joint compound used (if any) also affect θCH. A typical θCH
for a TO-220 mounted package is 1°C/W. Now we can solve
for θHA:
( )θHA
=
TJ – TA
PD
–
θJC + θCH
θ HA
=
125° C – 40° C
5W
–
(2.5° C/ W
+ 1° C/ W)
=
13.5° C/ W
To maintain junction temperature below 125°C, the heat
sink selected must have a θHA less than 14°C/W. In other
words, the heat sink temperature rise above ambient must be
less than 67.5°C (13.5°C/W x 5W). For example, at 5 Watts
Thermalloy model number 6030B has a heat sink
temperature rise of 66°C above ambient (θHA = 66°C/5W =
13.2°C/W), which is below the 67.5°C required in this
example. Figure 7 shows power dissipation versus ambient
temperature for a TO-220 package with a 6030B heat sink.
Another variable to consider is natural convection vs forced
convection air flow. Forced-air cooling by a small fan can
lower θCA (θCH + θHA) dramatically. Heat sink manufactures
provide thermal data for both of these cases. For additional
information on determining heat sink requirements, consult
Application Bulletin AB-038.
As mentioned earlier, once a heat sink has been selected the
complete design should be tested under worst-case load and
signal conditions to ensure proper thermal protection.
ENABLE/STATUS (E/S) PIN
The Enable/Status Pin provides two functions: forcing this
pin low disables the output stage, or, E/S can be monitored
to determine if the OPA548 is in thermal shutdown. One or
both of these functions can be utilized on the same device
using single or dual supplies. For normal operation (output
enabled), the E/S pin can be left open or pulled high (at least
2.4V above the negative rail). A small value capacitor
connected between the E/S pin and V– may be required for
noisy applications.
FIGURE 7. Maximum Power Dissipation vs Ambient
Temperature.
Heat Sink Selection Example
A TO-220 package is dissipating 5 Watts. The maximum
expected ambient temperature is 40°C. Find the proper heat
sink to keep the junction temperature below 125°C (150°C
minus 25°C safety margin).
Output Disable
A unique feature of the OPA548 is its output disable capa-
bility. This function not only conserves power during idle
periods (quiescent current drops to approximately 6mA) but
also allows multiplexing in low frequency (f<20kHz), mul-
tichannel applications. Signals greater than 20kHz may
cause leakage current to increase in devices that are shut-
down. Figure 18 shows the two OPA548s in a switched
amplifier configuration. The on/off state of the two amplifi-
ers is controlled by the voltage on the E/S pin.
®
11 OPA548
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet OPA548.PDF ] | |
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