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28F008B3 PDF даташит

Спецификация 28F008B3 изготовлена ​​​​«Intel» и имеет функцию, называемую «SMART 3 ADVANCED BOOT BLOCK BYTE-WIDE».

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Номер произв 28F008B3
Описание SMART 3 ADVANCED BOOT BLOCK BYTE-WIDE
Производители Intel
логотип Intel логотип 

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28F008B3 Даташит, Описание, Даташиты
E
PRELIMINARY
SMART 3 ADVANCED BOOT BLOCK
BYTE-WIDE
8-MBIT (1024K x 8), 16-MBIT (2056K x 8)
FLASH MEMORY FAMILY
28F008B3, 28F016B3
n Flexible SmartVoltage Technology
2.7V–3.6V Program/Erase
2.7V–3.6V Read Operation
12V VPP Fast Production
Programming
n 2.7V or 1.8V I/O Option
Reduces Overall System Power
n Optimized Block Sizes
Eight 8-Kbyte Blocks for Data,
Top or Bottom Locations
Up to Thirty-One 64-Kbyte Blocks
for Code
n High Performance
2.7V–3.6V: 120 ns Max Access Time
n Block Locking
VCC-Level Control through WP#
n Low Power Consumption
20 mA Maximum Read Current
n Absolute Hardware-Protection
VPP = GND Option
VCC Lockout Voltage
n Extended Temperature Operation
–40°C to +85°C
n Supports Code plus Data Storage
Optimized for FDI, Flash Data
Integrator Software
Fast Program Suspend Capability
Fast Erase Suspend Capability
n Extended Cycling Capability
10,000 Block Erase Cycles
n Automated Byte Program and Block
Erase
Command User Interface
Status Registers
n SRAM-Compatible Write Interface
n Automatic Power Savings Feature
n Reset/Deep Power-Down
1 µA ICCTypical
Spurious Write Lockout
n Standard Surface Mount Packaging
48-Ball µBGA* Package
40-Lead TSOP Package
n Footprint Upgradeable
Upgradeable from 2-, 4- and 8-Mbit
Boot Block
n ETOX™ V (0.4 µ) Flash Technology
n x8-Only Input/Output Architecture
For Space-Constrained 8-bit
Applications
The new Smart 3 Advanced Boot Block, manufactured on Intel’s latest 0.4µ technology, represents a feature-
rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability
(2.7V read, program and erase) with high-speed, low-power operation. Several new features have been
added, including the ability to drive the I/O at 1.8V, which significantly reduces system active power and
interfaces to 1.8V controllers. A new blocking scheme enables code and data storage within a single device.
Add to this the Intel-developed Flash Data Integrator (FDI) software and you have the most cost-effective,
monolithic code plus data storage solution on the market today. Smart 3 Advanced Boot Block Byte-Wide
products will be available in 40-lead TSOP and 48-ball µBGA* packages. Additional information on this
product family can be obtained by accessing Intel’s WWW page: http://www.intel.com/design/flcomp
May 1997
Order Number: 290605-001









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28F008B3 Даташит, Описание, Даташиты
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or
otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of
Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to
sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or
infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life
saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
The 28F008B3 and 28F016B3 may contain design defects or errors known as errata which may cause the product to deviate
from published specifications. Current characterized errata are available on request.
*Third-party brands and names are the property of their respective owners.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be
obtained from:
Intel Corporation
P.O. Box 7641
Mt. Prospect, IL 60056-7641
or call 1-800-879-4683
or visit Intel’s website at http:\\www.intel.com
COPYRIGHT © INTEL CORPORATION 1996, 1997
*Third-party brands and names are the property of their respective owners.
CG-041493









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28F008B3 Даташит, Описание, Даташиты
E
SMART 3 ADVANCED BOOT BLOCK–BYTE-WIDE
CONTENTS
PAGE
1.0 INTRODUCTION .............................................5
1.1 Smart 3 Advanced Boot Block Flash
Memory Enhancements ..............................5
1.2 Product Overview.........................................6
2.0 PRODUCT DESCRIPTION..............................6
2.1 Package Pinouts ..........................................7
2.2 Block Organization .....................................11
2.2.1 Parameter Blocks ................................11
2.2.2 Main Blocks .........................................11
3.0 PRINCIPLES OF OPERATION .....................14
3.1 Bus Operation ............................................14
3.1.1 Read....................................................15
3.1.2 Output Disable.....................................15
3.1.3 Standby ...............................................15
3.1.4 Deep Power-Down/Reset ....................15
3.1.5 Write....................................................15
3.2 Modes of Operation....................................15
3.2.1 Read Array ..........................................16
3.2.2 Read Intelligent Identifier .....................17
3.2.3 Read Status Register ..........................17
3.2.4 Program Mode.....................................18
3.2.5 Erase Mode .........................................19
3.3 Block Locking.............................................26
3.3.1 VPP = VIL for Complete Protection .......26
3.3.2 WP# = VIL for Block Locking................26
3.3.3 WP# = VIH for Block Unlocking ............26
3.4 VPP Program and Erase Voltages ..............26
PAGE
3.5 Power Consumption ...................................26
3.5.1 Active Power .......................................26
3.5.2 Automatic Power Savings (APS) .........27
3.5.3 Standby Power ....................................27
3.5.4 Deep Power-Down Mode.....................27
3.6 Power-Up/Down Operation.........................27
3.6.1 RP# Connected to System Reset ........27
3.6.2 VCC, VPP and RP# Transitions .............27
3.7 Power Supply Decoupling ..........................28
3.7.1 VPP Trace on Printed Circuit Boards ....28
4.0 ABSOLUTE MAXIMUM RATINGS ................29
5.0 OPERATING CONDITIONS
(VCCQ = 2.7V–3.6V).......................................29
5.1 DC Characteristics: VCCQ = 2.7V–3.6V.......30
6.0 OPERATING CONDITIONS
(VCCQ = 1.8V–2.2V).......................................34
6.1 DC Characteristics: VCCQ = 1.8V–2.2V.......34
7.0 AC CHARACTERISTICS...............................39
7.1 Reset Operations .......................................43
APPENDIX A: Ordering Information .................45
APPENDIX B: Write State Machine Current/
Next States ..................................................46
APPENDIX C: Access Time vs.
Capacitive Load...........................................47
APPENDIX D: Architecture Block Diagram ......48
APPENDIX E: Additional Information ...............49
PRELIMINARY
3










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Номер в каталогеОписаниеПроизводители
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