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PDF 74F74 Data sheet ( Hoja de datos )
| Número de pieza | 74F74 | |
| Descripción | Dual D-Type Positive Edge-Triggered Flip-Flop | |
| Fabricantes | National | |
| Logotipo |  |
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December 1994
54F 74F74
Dual D-Type Positive Edge-Triggered Flip-Flop
General Description
The ’F74 is a dual D-type flip-flop with Direct Clear and Set
inputs and complementary (Q Q) outputs Information at the
input is transferred to the outputs on the positive edge of
the clock pulse Clock triggering occurs at a voltage level of
the clock pulse and is not directly related to the transition
time of the positive-going pulse After the Clock Pulse input
threshold voltage has been passed the Data input is locked
out and information present will not be transferred to the
outputs until the next rising edge of the Clock Pulse input
Asynchronous Inputs
LOW input to SD sets Q to HIGH level
LOW input to CD sets Q to LOW level
Clear and Set are independent of clock
Simultaneous LOW on CD and SD
makes both Q and Q HIGH
Features
Y Guaranteed 4000V minimum ESD protection
Commercial
74F74PC
74F74SC (Note 1)
74F74SJ (Note 1)
Military
54F74DM (Note 2)
54F74FM (Note 2)
54F74LM (Note 2)
Package
Number
N14A
J14A
M14A
M14D
W14B
E20A
Package Description
14-Lead (0 300 Wide) Molded Dual-In-Line
14-Lead Ceramic Dual-In-Line
14-Lead (0 150 Wide) Molded Small Outline JEDEC
14-Lead (0 300 Wide) Molded Small Outline EIAJ
14-Lead Cerpack
20-Lead Ceramic Leadless Chip Carrier Type C
Note 1 Devices also available in 13 reel Use Suffix e SCX
Note 2 Military grade device with environmental and burn-in processing Use suffix e DMQB FMQB and LMQB
Logic Symbols
IEEE IEC
TL F 9469–3
TL F 9469 – 4
TL F 9469 – 6
TRI-STATE is a registered trademark of National Semiconductor Corporation
C1995 National Semiconductor Corporation TL F 9469
RRD-B30M75 Printed in U S A
1 page  
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows
74F 74 S C X
Temperature Range Family
74F e Commercial
54F e Military
Device Type
Package Code
P e Plastic DIP
D e Ceramic DIP
F e Flatpak
L e Leadless Chip Carrier (LCC)
S e Small Outline SOIC JEDEC
SJ e Small Outline SOIC EIAJ
Special Variations
QB e Military grade device with
environmental and burn-in
processing
X e Devices shipped in 13 reel
Temperature Range
C e Commercial (0 C to a70 C)
M e Military (b55 C to a125 C)
Physical Dimensions inches (millimeters)
20-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
5
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet 74F74.PDF ] | |
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