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PDF SBB1089Z Data sheet ( Hoja de datos )
| Número de pieza | SBB1089Z | |
| Descripción | Cascadable Active Bias InGaP/GaAs HBT MMIC Amplifier | |
| Fabricantes | Sirenza Microdevices | |
| Logotipo |  |
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t4U.com SSBBBB--11008899Z PbProduct Description
eSirenza Microdevices’ SBB-1089 is a high performance InGaP HBT MMIC
eamplifier utilizing a Darlington configuration with an active bias network.
hThe active bias network provides stable current over temperature and
Sprocess Beta variations. Designed to run directly from a 5V supply, the
taSBB-1089 does not require a dropping resistor as compared to typical
Darlington amplifiers. The SBB-1089 product is designed for high linearity
a5V gain block applications that require small size and minimal external
.Dcomponents. It is internally matched to 50 ohms.
RoHS Compliant
& Green Package
50 - 850 MHz, Cascadable
Active Bias InGaP/GaAs HBT MMIC Amplifier
wThe matte tin finish on Sirenza’s lead-free package utilizes a post annealing
wprocess to mitigate tin whisker formation and is RoHS compliant per EU
wDirective 2002/95. This package is also manufactured with green molding
compounds that contain no antimony trioxide nor halogenated fire retardants.
mGain & Return Loss vs. Frequency (w/ App. Ckt.)
o35
.c25
S21
15
U5
t4-5
-15 S11
e-25
S22
e-35
50 150 250 350 450 550 650 750 850
hFrequency (MHz)
Product Features
• Available in Lead Free, RoHS compliant, & Green packaging
• IP3 = 43.1 dBm @ 240MHz
• P1dB = 19.6 dBm @ 500MHz
• Single Fixed 5V Supply
• Robust 1000V ESD, Class 1C
• Patented Thermal Design & Patent Pending Bias Circuit
• Low Thermal Resistance
• MSL 1 moisture rating
Applications
• Receiver IF Amplifier
• Cellular, PCS, GSM, UMTS
• Wireless Data, Satellite Terminals
SSymbol
Parameters
Units
Frequency
Min.
Typ.
Max.
taS21 Small Signal Gain
aP1dB Output Power at 1dB Compression
.DIP3 Third Order Intercept Point
dB
dBm
dBm
70 MHz
240 MHz
400 MHz
70 MHz
240 MHz
400 MHz
70 MHz
240 MHz
400 MHz
14
14
18
38.5
15.5
15.5
15.5
19
19
19
42
43
40.5
17
17
wBandwidth
wIRL
S11, S22: Minimum 10dB Return Loss (typ.)
Input Return Loss
MHz
dB
70 -500MHz
14
50 - 850
18
ORL
Output Return Loss
dB 70 -500MHz
12
16
w om|S12| Reverse Isolation
dB 70 -500MHz
18
.cNF Noise Figure
dB 500 MHz
3.5 4.2
UVD
t4ID
eeRTH, j-l
Device Operating Voltage
Device Operating Current
Thermal Resistance (junction - lead)
V
mA
°C/W
5 5.3
82 90 98
48.8
ShTest Conditions:
VD = 5V
TL = 25°C
ID = 90mA Typ.
ZS = ZL = 50 Ohms
OIP3 Tone Spacing = 1MHz, Pout per tone = 0 dBm
Tested with Bias Tees
taThe information provided herein is believed to be reliable at press time. Sirenza Microdevices assumes no responsibility for inaccuracies or omissions. Sirenza Microdevices assumes no responsibility for the use of this
ainformation, and all such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or
granted to any third party. Sirenza Microdevices does not authorize or warrant any Sirenza Microdevices product for use in life-support devices and/or systems. Copyright 2001 Sirenza Microdevices, Inc.. All worldwide rights
reserved.
.D303 S. Technology Ct.
Phone: (800) SMI-MMIC
http://www.sirenza.com
wwwBroomfield, CO 80021
1
EDS-103998 Rev C
1 page  
SBB-1089 50-850 MHz Cascadable MMIC Amplifier
Application Schematic
Vs
1uF
1200pF
4
RF in
1
SBB-1089
3
Cb
2
Evaluation Board Layout
Ls
Lc
Cb
RF out
Application Circuit Element Values
Reference
Designator
Frequency (MHz)
50 to 850
CB 8200pF
LC 1200nH LS Coilcraft
LS 2.7nH Toko
Absolute Maximum Ratings
Parameter
Absolute Limit
Ma. Dvice Current (ID)
Max Device Voltage (VD)
Max. RF Input Power
110 mA
5.5 V
+12 dBm
Max. Operating Dissipated
Power
0.61 W
Max. Junction Temp. (TJ)
Operating Temp. Range (TL)
Max. Storage Temp.
+150°C
-40°C to +85°C
+150°C
Operation of this device beyond any one of these limits may cause
permanent damage. For reliable continuous operation, the device
voltage and current must not exceed the maximum operating
values specified in the table on page one.
Bias Conditions should also satisfy the following expression:
IDVD < (TJ - TL) / RTH, j-l TL=TLEAD
ESD Class 1C
Appropriate precautions in handling, packaging and testing
devices must be observed.
Mounting Instructions
1. Solder the copper pad on the backside of the device package to
the ground plane.
2. Use a large ground pad area with many plated through-holes as
shown.
3. We recommend 1 or 2 ounce copper. Measurement for this
datasheet were made on a 31 mil thick FR-4 board with 1
ounce copper on both sides.
MSL (Moisture Sensitivity Level) Rating: Level 1
303 S. Technology Ct.
Broomfield, CO 80021
Phone: (800) SMI-MMIC
5
http://www.sirenza.com
EDS-103998 Rev C
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet SBB1089Z.PDF ] | |
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