NCP1523 PDF даташит
Спецификация NCP1523 изготовлена «ON Semiconductor» и имеет функцию, называемую «Adjustable Output Voltage Stepdown Converter». |
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Детали детали
Номер произв | NCP1523 |
Описание | Adjustable Output Voltage Stepdown Converter |
Производители | ON Semiconductor |
логотип |
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NCP1523
3 MHz, 600 mA,
High−Efficiency, Adjustable
Output Voltage Stepdown
Converter
The NCP1523 stepdown PWM DC−DC converter is optimized for
portable applications powered from 1−cell Li−ion or 3−cell
Alkaline/NiCd/NiMH batteries. The device is available in an
adjustable output voltage from 0.9 V to 2.3 V. It uses synchronous
rectification to increase efficiency and reduce external part count. The
device also has a built−in 3 MHz (nominal) oscillator which reduces
component size by allowing a small inductor and capacitors.
Automatic switching PWM/PFM mode offers improved system
efficiency.
Finally, it includes an integrated soft−start, cycle−by−cycle current
limiting, and thermal shutdown protection. The NCP1523 is available
in a space saving, 8 pin chip scale package.
Features
• Up to 93% Efficiency
• Sources up to 600 mA
• 3 MHz Switching Frequency
• Adjustable Output Voltage from 0.9 V to 2.3 V
• 60 mA Quiescent Current
• Synchronous Rectification for Higher Efficiency.
• 2.7 V to 5.5 V Input Voltage Range
• Thermal Limit Protection
• Shutdown Current Consumption of 0.3 mA
• This is a Pb−Free Device*
Typical Applications
• Cellular Phones, Smart Phones and PDAs
• Digital Still Cameras
• MP3 Players and Portable Audio Systems
• Wireless and DSL Modems
• Portable Equipment
VIN
A2 VIN
SW B1
L
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MARKING
DIAGRAM
NCP1523G
A1 AYWW
FLIP−CHIP−8
CASE 766AE
A1
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
A1 A2
B1 B2
C1 C3
D1 D2
Top View
(Bumps Below)
PIN:
A1 − GND
A2 − VIN
B1 − SW
B2 − EN
C1 − GND
C2 − ADJ
D1 − VOUT
D2 − FB
ORDERING INFORMATION
Device
Package
Shipping†
NCP1523FCT2G FLIP−CHIP−8
(Pb−Free)
3000 /
Tape * Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
VOUT Brochure, BRD8011/D.
CIN C1
GND
VOUT D1
COUT
OFF ON
A1 GND
B2 EN
ADJ C2
FB D2
R1
Figure 1. NCP1523 Typical Applications
R2
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
August, 2006 − Rev. 0
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Publication Order Number:
NCP1523/D
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VBATTERY
VIN
A2
4.7 mF
GND
C1
GND
A1
Enable
EN
B2
NCP1523
100
90
80
70
60
50
40
30
1
VIN = 2.7 V
VIN = 4.2 V
VIN = 3.6 V
10 100
IOUT, OUTPUT CURRENT (mA)
Figure 2. Efficiency vs. Output Current
(VOUT = 2.0 V, Temperature = 25°C)
1000
TYPICAL APPLICATIONS
Q1
PWM/PFM
Control
Q2
SW
B1
VOUT
D1
ILIMIT
Comp
ADJ
C2
Logic Control &
Thermal Shutdown
Reference Voltage
Figure 3. Simplified Block Diagram
FB
D2
2.2 mH
4.7 mF
R1
R2
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NCP1523
PIN FUNCTION DESCRIPTION
Pin Pin Name
Type
A1
GND
Power Ground
B2 VIN Power Input
B1 SW Analog Output
B2 EN
Digital Input
C1
GND
Power Ground
C2 ADJ Analog Input
D1 VOUT Analog Input
D2 FB Analog Input
Description
Ground connection for the NFET Power Stage and the analog sections.
Power Supply Input for the PFET Power stage and the Analog Sections of the IC.
Connection from Power MOSFETs to the Inductor.
Enable for Switching Regulator. This pin is active high. This pin contains an internal
pulldown resistor.
Ground connection for the NFET Power Stage and the analog sections.
This pin is the compensation input. R1 is connected to this pin.
This pin is connected of the converter’s output. This is the sense of the output voltage.
Feedback voltage from the output of the power supply. This is the input to the error
amplifier.
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Minimum Voltage All Pins
Maximum Voltage All Pins (Note 1)
Maximum Voltage Enable, FB, SW
Thermal Resistance, Junction−to−Air (Note 2)
Operating Ambient Temperature Range
Storage Temperature Range
Junction Operating Temperature
Latchup Current maximum Rating TA = 85°C (Note 4)
ESD Withstand Voltage (Note 3)
Human Body Model
Machine Model
VMIN
VMAX
VMAX
RJA
TA
TSTG
TJ
LU
VESD
−0.3
7
VIN + 0.3
159
−40 to 85
−55 to 150
−40 to 125
"100
2.0
200
V
V
V
°C/W
°C
°C
°C
mA
kV
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. According to JEDEC standard JESD22−A108B
2. For the 8−Pin Chip scale package, the RJA is highly dependent of the PCB heatsink area. RJA = 159°C/W with 50 mm2 PCB heatsink area.
3. This device series contains ESD protection and exceeds the following tests:
Human Body Model (HBM) $2.0 kV per JEDEC standard: JESD22−A114
Machine Model (MM) $200 V per JEDEC standard: JESD22−A115
4. Latchup current maximum rating per JEDEC standard: JESD78.
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