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PDF HMC324MS8G Data sheet ( Hoja de datos )
| Número de pieza | HMC324MS8G | |
| Descripción | HBT DUAL DRIVER AMPLIFIER DC | |
| Fabricantes | Hittite Microwave | |
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MICROWAVE CORPORATION
HMC324MS8G
HBT DUAL DRIVER AMPLIFIER DC - 3.0 GHz
FEBRUARY 2001
V00.1200
Features
P1dB Output Power: + 16 dBm
1 Output IP3: +31 dBm
Single Supply: 8.75V
Ultra Small Package: MSOP8G
General Description
The HMC324MS8G is a high efficiency GaAs
InGaP Heterojunction Bipolar Transistor (HBT)
MMIC amplifier that contains two un-connected
amplifiers in parallel inside an 8 lead MSOPG
package. When used in conjunction with an
external balun, the outputs of the amplifier can
be combined to reduce the 2nd harmonic distor-
tion that is generated by the amplifier. With Vcc
at +7.5V, the HMC324MS8G offers 13 dB of
gain and with power combining and harmonic
cancellation, +22 dBm of output power can be
achieved. Using a Darlington feedback pair re-
sults in reduced sensitivity to normal process
variations and provides a good 50-ohm input/
output port match. This amplifier is ideal for RF
systems where high linearity is required. The
design can operate in 50-ohm and 75-ohm sys-
tems which makes it ideal for CATV head-end
and modem, and MCNS applications.
Guaranteed Performance, -40 to +60 deg C
Parameter
Frequency Range
Gain @ 25 °C
Gain Variation over Temperature
Input Return Loss
Output Return Loss
Reverse Isolation
Output Power for 1dB Compression (P1dB) @ 1 GHz
Saturated Output Power (Psat) @ 1 GHz
Output Third Order Intercept (IP3) @ 1 GHz
Noise Figure
Supply Current (Icc)
Min.
10
8
6
16
13
16
28
Vs= 8.75V, RBIAS= 22 Ohm
Typ.
Max.
DC - 3.0
13 16
0.015
0.025
13
9
20
16
19
31
6
57
Units
GHz
dB
dB/ °C
dB
dB
dB
dBm
dBm
dBm
dB
mA
Note: All specifications refer to a single amplifier.
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343
1 - 156
Fax: 978-250-3373
Web Site: www.hittite.com
1 page  
MICROWAVE CORPORATION
HMC324MS8G
HBT DUAL DRIVER AMPLIFIER DC - 3.0 GHz
FEBRUARY 2001
Evaluation PCB for HMC324MS8G
V00.1200
1
The circuit board used in the final application should use RF circuit design techniques. Signal lines should have
50 ohm impedance while the package ground leads and exposed paddle should be connected directly to the
ground plane similar to that shown above. A sufficient number of VIA holes should be used to connect the top
and bottom ground planes. The evaluation circuit board as shown is available from Hittite upon request.
Evaluation Circuit Board Layout Design Details
Item
J1 - J4
U1
PCB*
Description
PC Mount SMA Connector
HMC324MS8G
104221 Evaluation PCB 1.5" x 1.5"
*Circuit Board Material: Rogers 4350
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343
1 - 160
Fax: 978-250-3373
Web Site: www.hittite.com
5 Page | ||
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| PDF Descargar | [ Datasheet HMC324MS8G.PDF ] | |
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