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PDF HMC323 Data sheet ( Hoja de datos )

Número de pieza HMC323
Descripción HBT DRIVER AMPLIFIER DC
Fabricantes HITTITE 
Logotipo HITTITE Logotipo



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No Preview Available ! HMC323 Hoja de datos, Descripción, Manual

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MICROWAVE CORPORATION
HMC323
HBT DRIVER AMPLIFIER DC - 3.0 GHz
FEBRUARY 2001
V00.1100
Features
P1dB Output Power: + 16 dBm
1 Output IP3: +31 dBm
Single Supply: 8.75V
Ultra Small SOT26 Package
General Description
The HMC323 is a GaAs InGaP Heterojunction
Bipolar Transistor (HBT) MMIC amplifier that
operates from a single Vcc supply. The surface
mount SOT26 amplifier can be used as a broad-
band gain stage or used with external matching
for optimized narrow band applications. The
HMC323 offers 13 dB of gain and +19 dBm of
saturated power while only requiring 57 mA from
a 8.75V supply. Using a Darlington feedback
pair results in reduced sensitivity to normal
process variations and provides a good 50-ohm
input/output port match. This amplifier is ideal for
RF systems where high linearity is required
such as 2.2 - 2.7 GHz MMDS.
Guaranteed Performance, -40 to +60 deg C
Parameter
Frequency Range
Gain @ 25 °C
Gain Variation over Temperature
Input Return Loss
Output Return Loss
Reverse Isolation
Output Power for 1dB Compression (P1dB) @ 1 GHz
Saturated Output Power (Psat) @ 1 GHz
Output Third Order Intercept (IP3) @ 1 GHz
Noise Figure
Supply Current (Icc)
Vs= 8.75V, RBIAS= 22 Ohm
Min. Typ. Max.
DC - 3.0
10 13 16
0.015
0.025
8 13
69
16 20
13 16
16 19
28 31
6
57
Units
GHz
dB
dB/ °C
dB
dB
dB
dBm
dBm
dBm
dB
mA
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343
1 - 150
Fax: 978-250-3373
Web Site: www.hittite.com

1 page




HMC323 pdf
MICROWAVE CORPORATION
HBT DRIVER AMPLIFIER DC - 3.0 GHz
FEBRUARY 2001
Evaluation PCB for HMC323
HMC323
V00.1100
1
The circuit board used in the final application should use RF circuit design techniques. Signal lines should have
50 ohm impedance while the package ground leads and exposed paddle should be connected directly to the
ground plane similar to that shown above. A sufficient number of VIA holes should be used to connect the top
and bottom ground planes. The evaluation circuit board as shown is available from Hittite upon request.
Evaluation Circuit Board Layout Design Details
Item
J1 - J2
U1
PCB*
Description
PC Mount SMA Connector
HMC323
104196 Evaluation PCB 1.5" x 1.5"
*Circuit Board Material: Rogers 4350
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343
1 - 154
Fax: 978-250-3373
Web Site: www.hittite.com

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