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PDF S71WS512N Data sheet ( Hoja de datos )
| Número de pieza | S71WS512N | |
| Descripción | Stacked Multi-Chip Product (MCP) | |
| Fabricantes | SPANSION | |
| Logotipo |  |
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S71WS-N
Stacked Multi-Chip Product (MCP)
1.8 Volt-only Simultaneous Read/Write,
Burst-mode Flash Memory with CellularRAM™
Data Sheet (Advance Information)
S71WS-N Cover Sheet
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.
Publication Number S71WS-N_00
Revision A Amendment 6
Issue Date July 19, 2006
1 page  
Data Sheet (Advance Information)
2. Ordering Information
The order number is formed by a valid combinations of the following:
S71WS 256 N C
0 BA W
A K0
Packing Type
0 = Tray
2 = 7” Tape and Reel
3 = 13” Tape and Reel
RAM Supplier, DYB Power Up, Speed Combinations
K = 2 = CellularRAM 2, 0, 54 MHz
P = 2 = CellularRAM 2, 1, 54 MHz
J = 2 = CellularRAM 2, 0, 66 MHz
N = 2 = CellularRAM 2, 1, 66 MHz
H = 2 = CellularRAM 2, 0, 80 MHz
M = 2 = CellularRAM 2, 1, 80 MHz
Package Modifier
A = 8x11.6x1.2 mm, 84-ball FBGA
T = 8x11.6x1.4 mm, 84-ball FBGA
E = 9x12x1.4 mm, 84-ball FBGA
Y = 9x12x1.2 mm, 84-ball FBGA
Temperature Range
W = Wireless (-25°C to +85°C)
Package Type
BA = Very Thin FIne-Pitch BGA, Lead (Pb)-free Compliant Package
BF = Very Thin FIne-Pitch BGA, Lead (Pb)-free Package
Chip Contents—2
No content
pSRAM Density
B = 32 Mb
C = 64 Mb
D = 128 Mb
Process Technology
N = 110-nm MirrorBit™ Technology
Code Flash Density
512= 512 Mb (2x256Mb)
256= 256 Mb
128= 128 Mb
Product Family
S71WS = Multi-Chip Product, 1.8 Volt-only Simultaneous Read/Write Burst
Mode Flash Memory + pSRAM
2.1
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
Table 2.1 MCP Configurations and Valid Combinations
S71WS128N
S71WS256N
S71WS512N
Valid Combinations
B
C
C
D0
BAW, BFW
C
D
A
A
A
Y
A
T
E
K, P, J, N, H, M
K, P, J, N, H, M
K, P, J, N, H, M
K, P, J, N, H, M
K, P, H, M
J, N, H, M
K, P, J, N, H, M
Package Marking Note:
The package marking omits the leading S from the ordering part number.
July 19, 2006 S71WS-N_00_A6
S71WS-N
3
5 Page 
Data Sheet (Advance Information)
5.3.3
TSD084—84-ball Fine-Pitch Ball Grid Array (FBGA) 12.0 x 9.0 x 1.2 mm
0.15 C
(2X)
D
PIN A1
CORNER
INDEX MARK
10
TOP VIEW
A A2
A
eD
D1
10
9
8
7
E
6
5
4
eE 3
2
1
B
0.15 C
(2X)
0.20 C
ML K J HG F E D C B A
7
SD
BOTTOM VIEW
SE 7
E1
PIN A1
CORNER
A1
6
SIDE VIEW
84X b
0.15 M C A B
0.08 M C
C 0.08 C
PACKAGE
JEDEC
TSD 084
N/A
DxE
SYMBOL
A
A1
A2
D
E
D1
E1
MD
ME
n
φb
eE
eD
SD / SE
12.00 mm x 9.00 mm
PACKAGE
MIN
NOM
MAX
NOTE
--- --- 1.20 PROFILE
0.17 ---
--- BALL HEIGHT
0.81 --- 0.94 BODY THICKNESS
12.00 BSC.
BODY SIZE
9.00 BSC.
BODY SIZE
8.80 BSC.
MATRIX FOOTPRINT
7.20 BSC.
MATRIX FOOTPRINT
12 MATRIX SIZE D DIRECTION
10 MATRIX SIZE E DIRECTION
84 BALL COUNT
0.35 0.40 0.45 BALL DIAMETER
0.80 BSC.
BALL PITCH
0.80 BSC
BALL PITCH
0.40 BSC.
SOLDER BALL PLACEMENT
A2,A3,A4,A5,A6,7,A8,A9
B1,B10,C1,C10,D1,D10
E1,E10,F1,F10,G1,G10
H1,H10,J1,J10,K1,K10,L1,L10
M2,M3,M4,M5,M6,M7,M8,M9
DEPOPULATED SOLDER BALLS
NOTES:
1. DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9. N/A
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3426\ 16-038.22
July 19, 2006 S71WS-N_00_A6
S71WS-N
9
11 Page | ||
| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet S71WS512N.PDF ] | |
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