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PDF SA58632 Data sheet ( Hoja de datos )
| Número de pieza | SA58632 | |
| Descripción | 2 x 2.2W BTL Audio Amplifier | |
| Fabricantes | NXP Semiconductors | |
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SA58632
2 × 2.2 W BTL audio amplifier
Rev. 01 — 27 June 2006
Product data sheet
1. General description
The SA58632 is a two-channel audio amplifier in an HVQFN20 package. It provides
power output of 2.2 W per channel with an 8 Ω load at 9 V supply. The internal circuit is
comprised of two BTL (Bridge-Tied Load) amplifiers with a complementary PNP-NPN
output stage and standby/mute logic. The SA58632 is housed in a 20-pin HVQFN
package, which has an exposed die attach paddle enabling reduced thermal resistance
and increased power dissipation.
2. Features
I Low junction-to-ambient thermal resistance using exposed die attach paddle
I Gain can be fixed with external resistors from 6 dB to 30 dB
I Standby mode controlled by CMOS-compatible levels
I Low standby current < 10 µA
I No switch-on/switch-off plops
I High power supply ripple rejection: 50 dB minimum
I ElectroStatic Discharge (ESD) protection
I Output short circuit to ground protection
I Thermal shutdown protection
3. Applications
I Professional and amateur mobile radio
I Portable consumer products: toys and games
I Personal computer remote speakers
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Philips Semiconductors
SA58632
2 × 2.2 W BTL audio amplifier
8. Functional description
The SA58632 is a two-channel BTL audio amplifier capable of delivering 2 × 1.5 W output
power to an 8 Ω load at THD+N = 10 % using a 6 V power supply. It is also capable of
delivering 2 × 2.2 W output power to an 8 Ω load at THD+N = 10 % using a 9 V power
supply. Using the MODE pin, the device can be switched to standby and mute condition.
The device is protected by an internal thermal shutdown protection mechanism. The gain
can be set within a range of 6 dB to 30 dB by external feedback resistors.
8.1 Power amplifier
The power amplifier is a Bridge-Tied Load (BTL) amplifier with a complementary
PNP-NPN output stage. The voltage loss on the positive supply line is the saturation
voltage of a PNP power transistor, on the negative side the saturation voltage of an NPN
power transistor. The total voltage loss is < 1 V. With a supply voltage of 6 V and an 8 Ω
loudspeaker, an output power of 1.5 W can be delivered to the load, and with a 9 V supply
voltage and an 8 Ω loudspeaker an output power of 2.2 W can be delivered.
8.2 Mode select pin (MODE)
The device is in Standby mode (with a very low current consumption) if the voltage at the
MODE pin is greater than VCC − 0.5 V, or if this pin is floating. At a MODE voltage in the
range between 1.5 V and VCC − 1.5 V the amplifier is in a mute condition. The mute
condition is useful to suppress plop noise at the output, caused by charging of the input
capacitor. The device is in Active mode if the MODE pin is grounded or less than 0.5 V
(see Figure 6).
8.3 BTL/SE output configuration
To invoke the BTL configuration (see Figure 3), the BTL/SE pin is taken to logic HIGH or
not connected. The output differentially drives the speakers, so there is no need for
coupling capacitors. The headphone can be connected to the amplifier negative outputs
using a coupling capacitor for each channel. The headphone common ground is
connected to the amplifier ground.
To invoke the Single-Ended (SE) configuration (see Figure 15), the BTL/SE pin is taken to
logic LOW or connected to ground. The positive outputs are muted with a DC level of
0.5VCC. Using a coupling capacitor for each channel, speakers can be connected to the
amplifier negative outputs. The speaker common ground is connected to the amplifier
ground. Headphones can be connected to the negative outputs without using output
coupling capacitors. The headphone common ground pin is connected to one of the
amplifier positive output pins.
SA58632_1
Product data sheet
Rev. 01 — 27 June 2006
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
5 of 26
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Philips Semiconductors
SA58632
2 × 2.2 W BTL audio amplifier
14.3 Thermal behavior
The measured thermal performance of the HVQFN20 package is highly dependent on the
configuration and size of the heat spreader on the application demo board. Data may not
be comparable between different semiconductors manufacturers because the application
demo boards and test methods are not standardized. Also, the thermal performance of
packages for a specific application may be different than presented here, because of the
configuration of the copper heat spreader of the application boards may be significantly
different.
Philips Semiconductors uses FR-4 type application boards with 1 ounce copper traces
with solder coating.
The demo board (see Figure 23) has a 1 ounce copper heat spreader that runs under the
IC and provides a mounting pad to solder to the die attach paddle of the HVQFN20
package. The heat spreader is symmetrical and provides a heat spreader on both top and
bottom of the PCB. The heat spreader on top and bottom side of the demo board is
connected through 2 mm diameter plated through holes. Directly under the DAP (Die
Attach Paddle), the top and bottom side of the PCB are connected by four vias. The total
top and bottom heat spreader area is 64.5 mm2 (10 in2).
The junction to ambient thermal resistance, Rth(j-a) = 22 K/W for the HVQFN20 package
when the exposed die attach paddle is soldered to 5 square inch area of 1 ounce copper
heat spreader on the demo PCB. The maximum sine wave power dissipation for
Tamb = 25 °C is:
1----5---0-2---–2-----2---5- = 5.7 W
Thus, for Tamb = 60 °C the maximum total power dissipation is:
1----5---0-2---–2-----6---0- = 4.1 W
The power dissipation versus ambient temperature curve (Figure 10) shows the power
derating profiles with ambient temperature for three sizes of heat spreaders. For a more
modest heat spreader using 5 square inch area on the top or bottom side of the PCB, the
Rth(j-a) is 31 K/W. When the package is not soldered to a heat spreader, the Rth(j-a)
increases to 60 K/W.
SA58632_1
Product data sheet
Rev. 01 — 27 June 2006
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
11 of 26
11 Page | ||
| Páginas | Total 26 Páginas | |
| PDF Descargar | [ Datasheet SA58632.PDF ] | |
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