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PDF HA9P5002-9 Data sheet ( Hoja de datos )
| Número de pieza | HA9P5002-9 | |
| Descripción | 110MHz/ High Slew Rate/ High Output Current Buffer | |
| Fabricantes | Intersil Corporation | |
| Logotipo |  |
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Data Sheet
HA-5002
November 1998 File Number 2921.4
110MHz, High Slew Rate, High Output
Current Buffer
The HA-5002 is a monolithic, wideband, high slew rate, high
output current, buffer amplifier.
Utilizing the advantages of the Intersil D.I. technologies, the
HA-5002 current buffer offers 1300V/µs slew rate with
110MHz of bandwidth. The ±200mA output current capability
is enhanced by a 3Ω output impedance.
The monolithic HA-5002 will replace the hybrid LH0002 with
corresponding performance increases. These characteristics
range from the 3000kΩ input impedance to the increased
output voltage swing. Monolithic design technologies have
allowed a more precise buffer to be developed with more than
an order of magnitude smaller gain error.
The HA-5002 will provide many present hybrid users with a
higher degree of reliability and at the same time increase
overall circuit performance.
For the military grade product, refer to the HA-5002/883
datasheet, AnswerFAX document #3705.
Features
• Voltage Gain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.995
• High Input Impedance . . . . . . . . . . . . . . . . . . . . . 3000kΩ
• Low Output Impedance . . . . . . . . . . . . . . . . . . . . . . . . 3Ω
• Very High Slew Rate . . . . . . . . . . . . . . . . . . . . . 1300V/µs
• Very Wide Bandwidth . . . . . . . . . . . . . . . . . . . . . . 110MHz
• High Output Current . . . . . . . . . . . . . . . . . . . . . . . ±200mA
• Pulsed Output Current . . . . . . . . . . . . . . . . . . . . . . 400mA
• Monolithic Construction
Applications
• Line Driver
• Data Acquisition
• 110MHz Buffer
• Radar Cable Driver
• High Power Current Booster
• High Power Current Source
• Sample and Holds
• Video Products
Ordering Information
PART NUMBER TEMP.
(BRAND)
RANGE (oC)
PACKAGE
PKG. NO.
HA2-5002-2
-55 to 125 8 Pin Metal Can T8.C
HA2-5002-5
0 to 75 8 Pin Metal Can T8.C
HA3-5002-5
0 to 75 8 Ld PDIP
E8.3
HA4P5002-5
0 to 75 20 Ld PLCC
N20.35
HA7-5002-2
-55 to 125 8 Ld CERDIP F8.3A
HA7-5002-5
0 to 75 8 Ld CERDIP F8.3A
HA9P5002-5
(H50025)
0 to 75 8 Ld SOIC
M8.15
HA9P5002-9
(H50029)
-40 to 85 8 Ld SOIC
M8.15
Pinouts
HA-5002 (PDIP, CERDIP, SOIC)
TOP VIEW
V1+ 1
V2- 2
NC 3
IN 4
8 OUT
7 V2+
6 NC
5 V1-
NC 4
V2- 5
NC 6
NC 7
NC 8
HA-5002 (PLCC)
TOP VIEW
3 2 1 20 19
9 10 11 12 13
18 NC
17 V2+
16 NC
15 NC
14 NC
HA-5002 (METAL CAN)
TOP VIEW
IN
8
V1+ 1
7 V1-
V2+ 2
6 V2-
NC 3
4
OUT
5 NC
NOTE: Case Voltage = Floating
1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
1 page  
HA-5002
1.8
1.6
1.4 CAN
1.2
1.0
0.8
0.6 SOIC
0.4
PLCC
CERDIP
PDIP
PDMAX = θ----J---TC----J-+--M---θ-A--C--X---S--–---+--T---θ-A--S----A--
Where: TJMAX = Maximum Junction Temperature of the
Device
TA = Ambient
θJC = Junction to Case Thermal Resistance
θCS = Case to Heat Sink Thermal Resistance
θSA = Heat Sink to Ambient Thermal Resistance
0.2
0.0
25
QUIESCENT POWER DISSIPATION
AT ±15V SUPPLIES
45 65 85
TEMPERATURE (oC)
105
Graph is based on: PDMAX = T----J---M-----θA---J-X--A---–-----T----A-
125
FIGURE 2. MAXIMUM POWER DISSIPATION vs TEMPERATURE
Typical Application
+12V
V1+ V2+
RS RM
50Ω 50Ω
VIN
V1- V2-
-12V
RG -58
VOUT
RL 50Ω
VIN
VOUT
FIGURE 3. COAXIAL CABLE DRIVER - 50Ω SYSTEM
Typical Performance Curves
9
6 VS = ±15V, RS = 50Ω
3
GAIN
0
-3
PHASE
-6
-9
-12
-15
-18
1
10
FREQUENCY (MHz)
0o
45o
90o
135o
180o
100
FIGURE 4. GAIN/PHASE vs FREQUENCY (RL = 1kΩ)
9
6
3
0
-3
-6
-9
-12
-15
-18
1
VS = ±15V, RS = 50Ω
GAIN
PHASE
10
FREQUENCY (MHz)
0o
45o
90o
135o
180o
100
FIGURE 5. GAIN/PHASE vs FREQUENCY (RL = 50Ω)
5
5 Page 
HA-5002
Plastic Leaded Chip Carrier Packages (PLCC)
0.042 (1.07)
0.048 (1.22)
PIN (1) IDENTIFIER
CL
0.042 (1.07)
0.056 (1.42)
0.050 (1.27) TP
0.004 (0.10) C
0.025 (0.64) R
0.045 (1.14)
CL
E1 E
D2/E2
D2/E2
VIEW “A”
0.020 (0.51) MAX
3 PLCS
D1
D
0.026 (0.66)
0.032 (0.81)
0.020 (0.51)
MIN
A1
A
-C-
SEATING
PLANE
0.013 (0.33)
0.021 (0.53)
N20.35 (JEDEC MS-018AA ISSUE A)
20 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN MAX MIN MAX NOTES
A
0.165 0.180 4.20
4.57
-
A1
0.090 0.120 2.29
3.04
-
D 0.385 0.395 9.78 10.03 -
D1
0.350 0.356 8.89
9.04
3
D2 0.141 0.169 3.59 4.29 4, 5
E 0.385 0.395 9.78 10.03 -
E1
0.350 0.356 8.89
9.04
3
E2 0.141 0.169 3.59 4.29 4, 5
N 20
20 6
Rev. 2 11/97
0.045 (1.14)
MIN
0.025 (0.64)
MIN
VIEW “A” TYP.
NOTES:
17. Controlling dimension: INCH. Converted millimeter dimensions
are not necessarily exact.
18. Dimensions and tolerancing per ANSI Y14.5M-1982.
19. Dimensions D1 and E1 do not include mold protrusions. Allowable
mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1
and E1 include mold mismatch and are measured at the extreme
material condition at the body parting line.
20. To be measured at seating plane -C- contact point.
21. Centerline to be determined where center leads exit plastic body.
22. “N” is the number of terminal positions.
11
11 Page | ||
| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet HA9P5002-9.PDF ] | |
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