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Спецификация NCP9002 изготовлена «ON Semiconductor» и имеет функцию, называемую «Audio Power Amplifier». |
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Детали детали
Номер произв | NCP9002 |
Описание | Audio Power Amplifier |
Производители | ON Semiconductor |
логотип |
13 Pages
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NCP9002
1.3 Watt Audio Power
Amplifier with Fast Turn On
Time
The NCP9002 is an audio power amplifier designed for portable
communication device applications such as mobile phone
applications. The NCP9002 is capable of delivering 1.3 W of
continuous average power to an 8.0 W BTL load from a 5.0 V power
supply, and 1.0 W to a 4.0 W BTL load from a 3.6 V power supply.
The NCP9002 provides high quality audio while requiring few
external components and minimal power consumption. It features a
low−power consumption shutdown mode, which is achieved by
driving the SHUTDOWN pin with logic low.
The NCP9002 contains circuitry to prevent from “pop and click”
noise that would otherwise occur during turn−on and turn−off
transitions.
For maximum flexibility, the NCP9002 provides an externally
controlled gain (with resistors), as well as an externally controlled
turn−on time (with the bypass capacitor). When using a 1 mF bypass
capacitor, it offers 100 ms wake up time.
Due to its excellent PSRR, it can be directly connected to the
battery, saving the use of an LDO.
This device is available in a 9−Pin Flip−Chip CSP (Lead−Free).
Features
• 1.3 W to an 8.0 W BTL Load from a 5.0 V Power Supply
• Excellent PSRR: Direct Connection to the Battery
• “Pop and Click” Noise Protection Circuit
• Ultra Low Current Shutdown Mode: 10 nA
• 2.2 V−5.5 V Operation
• External Gain Configuration Capability
• External Turn−on Time Configuration Capability:
100 ms (1 mF Bypass Capacitor)
• Up to 1.0 nF Capacitive Load Driving Capability
• Thermal Overload Protection Circuitry
• This is a Pb−Free Device
Typical Applications
• Portable Electronic Devices
• PDAs
• Wireless Phones
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MARKING
DIAGRAMS
9−Pin Flip−Chip CSP A3
FC SUFFIX
MAZG
A1 CASE 499AL
AYWW
C1
A1
MAZ
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
PIN CONNECTIONS
9−Pin Flip−Chip CSP
A1 A2
INM OUTA
B1
VM_P
C1
B2
VM
C2
A3
INP
B3
Vp
C3
BYPASS OUTB SHUTDOWN
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 12 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
December, 2006 − Rev. 4
1
Publication Order Number:
NCP9002/D
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NCP9002
Rf
20 kW
Vp
AUDIO
INPUT
Ci Ri
47 nF 20 kW
INM
INP
Cbypass
BYPASS
1 mF
Cs 1 mF
− Vp
+
Vp
−
+
OUTA
R1
20 kW
R2
20 kW
OUTB
8W
VIH
VIL
SHUTDOWN
VM_P
SHUTDOWN
CONTROL
VM
Figure 1. Typical Audio Amplifier Application Circuit with Single Ended Input
+
AUDIO
INPUT
−
Rf
20 kW
Vp
Ci Ri
47 nF 20 kW
Ci Ri
INM
INP
47 nF 20 kW
20 kW
Cbypass
Rf
BYPASS
1 mF
Cs 1 mF
− Vp
+
Vp
−
+
OUTA
R1
20 kW
R2
20 kW
OUTB
VIH
VIL
SHUTDOWN
VM_P
SHUTDOWN
CONTROL
VM
8W
Figure 2. Typical Audio Amplifier Application Circuit with a Differential Input
This device contains 671 active transistors and 1899 MOS gates.
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NCP9002
PIN DESCRIPTION
Pin Type
A1 I
A2 O
A3 I
B1 I
B2 I
B3 I
C1 I
C2 O
C3 I
Symbol
INM
OUTA
INP
VM_P
VM
Vp
BYPASS
OUTB
SHUTDOWN
Description
Negative input of the first amplifier, receives the audio input signal. Connected to the
feedback resistor Rf and to the input resistor Rin.
Negative output of the NCP9002. Connected to the load and to the feedback resistor Rf.
Positive input of the first amplifier, receives the common mode voltage.
Power Analog Ground.
Core Analog Ground.
Positive analog supply of the cell. Range: 2.2 V−5.5 V.
Bypass capacitor pin which provides the common mode voltage (Vp/2).
Positive output of the NCP9002. Connected to the load.
The device enters in shutdown mode when a low level is applied on this pin.
MAXIMUM RATINGS (Note 1)
Rating
Symbol
Value
Unit
Supply Voltage
Operating Supply Voltage
Vp
Op Vp
6.0
2.2 to 5.5 V
2.0 V = Functional Only
V
−
Input Voltage
Max Output Current
Vin
−0.3 to Vcc +0.3
V
Iout 500 mA
Power Dissipation (Note 2)
Pd
Internally Limited
−
Operating Ambient Temperature
Max Junction Temperature
Storage Temperature Range
Thermal Resistance Junction−to−Air
ESD Protection
Human Body Model (HBM) (Note 4)
Machine Model (MM) (Note 5)
TA
TJ
Tstg
RqJA
−
−40 to +85
150
−65 to +150
(Note 3)
6000
>250
°C
°C
°C
°C/W
V
Latchup Current at TA = 85°C (Note 6)
−
±100
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = +25°C.
2. The thermal shutdown set to 160°C (typical) avoids irreversible damage on the device due to power dissipation. For further information see
page 9.
3. The RqJA is highly dependent of the PCB Heatsink area. For example, RqJA can equal 195°C/W with 50 mm2 total area and also 135°C/W with
500 mm2. For further information see page 10. The bumps have the same thermal resistance and all need to be connected to optimize the power
dissipation.
4. Human Body Model, 100 pF discharge through a 1.5 kW resistor following specification JESD22/A114.
5. Machine Model, 200 pF discharged through all pins following specification JESD22/A115.
6. Maximum ratings per JEDEC standard JESD78.
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