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PDF NSDEMN11XV6T1 Data sheet ( Hoja de datos )

Número de pieza NSDEMN11XV6T1
Descripción (NSDEMN11XV6T1 / NSDEMN11XV6T5) Common Cathode Quad Array Switching Diode
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NSDEMN11XV6T1,
NSDEMN11XV6T5
Common Cathode Quad
Array Switching Diode
This Common Cathode Epitaxial Planar Quad Diode is designed for
use in ultra high speed switching applications. This device is housed in
the SOT−563 package which is designed for low power surface mount
applications, where board space is at a premium.
Features
Fast trr
Low CD
Pb−Free Packages are Available
MAXIMUM RATINGS (TA = 25°C)
Rating
Reverse Voltage
Peak Reverse Voltage
Forward Current
Peak Forward Current
Peak Forward Surge Current
Symbol
VR
VRM
IF
IFM
IFSM
(Note 1)
Value
80
80
100
300
2.0
Unit
Vdc
Vdc
mAdc
mAdc
Adc
THERMAL CHARACTERISTICS
Characteristic
(One Junction Heated)
Symbol
Max
Unit
Total Device Dissipation @TA = 25°C
Derate above 25°C
PD 357 mW
(Note 2)
2.9 mW/°C
(Note 2)
Thermal Resistance, Junction-to-Ambient RqJA
350
(Note 2)
°C/W
Characteristic
(Both Junctions Heated)
Symbol
Max
Unit
Total Device Dissipation @TA = 25°C
Derate above 25°C
PD 500 mW
(Note 2)
4.0 mW/°C
(Note 2)
Thermal Resistance, Junction-to-Ambient RqJA
250
(Note 2)
°C/W
Junction and Storage Temperature
TJ, Tstg − 55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. t = 1 mS
2. FR−4 @ Minimum Pad
http://onsemi.com
(3) (2) (1)
(4) (5)
(6)
1
SOT−563
CASE 463A
PLASTIC
MARKING DIAGRAM
N9 M G
G
1
N9 = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping
NSDEMN11XV6T1 SOT−563 4000/Tape & Reel
NSDEMN11XV6T1G SOT−563 4000/Tape & Reel
(Pb−Free)
NSDEMN11XV6T5 SOT−563 8000/Tape & Reel
NSDEMN11XV6T5G SOT−563 8000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
May, 2006 − Rev. 2
1
Publication Order Number:
NSDEMN11XV6T1/D

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