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PDF NSS20600CF8T1G Data sheet ( Hoja de datos )
| Número de pieza | NSS20600CF8T1G | |
| Descripción | Low VCE(sat) PNP Transistor | |
| Fabricantes | ON Semiconductor | |
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NSS20600CF8T1G
20 V, 7.0 A, Low VCE(sat)
PNP Transistor
ON Semiconductor’s e2PowerEdge family of low VCE(sat)
transistors are miniature surface mount devices featuring ultra low
saturation voltage (VCE(sat)) and high current gain capability. These
are designed for use in low voltage, high speed switching applications
where affordable efficient energy control is important.
Typical applications are DC−DC converters and power management
in portable and battery powered products such as cellular and cordless
phones, PDAs, computers, printers, digital cameras and MP3 players.
Other applications are low voltage motor controls in mass storage
products such as disc drives and tape drives. In the automotive
industry they can be used in air bag deployment and in the instrument
cluster. The high current gain allows e2PowerEdge devices to be
driven directly from PMU’s control outputs, and the Linear Gain
(Beta) makes them ideal components in analog amplifiers.
• This is a Pb−Free Device
MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
Max Unit
Collector-Emitter Voltage
Collector-Base Voltage
Emitter-Base Voltage
Collector Current − Continuous
Collector Current − Peak
Electrostatic Discharge
VCEO
VCBO
VEBO
IC
ICM
ESD
−20 Vdc
−20 Vdc
−7.0 Vdc
−6.0 Adc
−7.0 A
HBM Class 3B
MM Class C
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max Unit
Total Device Dissipation, TA = 25°C
Derate above 25°C
PD (Note 1)
830 mW
6.7 mW/°C
Thermal Resistance,
Junction−to−Ambient
RqJA (Note 1)
150
°C/W
Total Device Dissipation, TA = 25°C
Derate above 25°C
PD (Note 2)
1.4 W
11.1 mW/°C
Thermal Resistance,
Junction−to−Ambient
RqJA (Note 2)
90
°C/W
Thermal Resistance,
Junction−to−Lead #1
RqJL (Note 2)
15
°C/W
Total Device Dissipation
(Single Pulse < 10 sec)
PDsingle
(Notes 2 & 3)
2.75
W
Junction and Storage
Temperature Range
TJ, Tstg
−55 to
+150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 @ 100 mm2, 1 oz copper traces.
2. FR−4 @ 500 mm2, 1 oz copper traces.
3. Thermal response.
© Semiconductor Components Industries, LLC, 2006
September, 2006 − Rev. 0
1
http://onsemi.com
−20 VOLTS, 7.0 AMPS
PNEPQLUOIVWALVECNET(saRt)DTSR(oAn)N5S0ISmTWOR
COLLECTOR
1, 2, 3, 6, 7, 8
4
BASE
5
EMITTER
ChipFET]
CASE 1206A
STYLE 4
MARKING DIAGRAM
VC M
G
VC = Specific Device Code
M = Date Code
G = Pb−Free Package
PIN CONNECTIONS
C8
C7
C6
E5
1C
2C
3C
4B
ORDERING INFORMATION
Device
Package
Shipping†
NSS20600CF8T1G ChipFET
(Pb−Free)
3000/
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
NSS20600CF8/D
1 page  
NSS20600CF8T1G
HE
e1
D
8765
1234
E
b
e
A
PACKAGE DIMENSIONS
ChipFET
CASE 1206A−03
ISSUE G
q
L
5678
4321
c
0.05 (0.002)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MOLD GATE BURRS SHALL NOT EXCEED 0.13 MM PER SIDE.
4. LEADFRAME TO MOLDED BODY OFFSET IN HORIZONTAL
AND VERTICAL SHALL NOT EXCEED 0.08 MM.
5. DIMENSIONS A AND B EXCLUSIVE OF MOLD GATE BURRS.
6. NO MOLD FLASH ALLOWED ON THE TOP AND BOTTOM LEAD
SURFACE.
MILLIMETERS
DIM MIN
NOM MAX
A 1.00
1.05
1.10
b 0.25 0.30 0.35
c 0.10 0.15 0.20
D 2.95
3.05
3.10
E 1.55 1.65 1.70
e 0.65 BSC
e1 0.55 BSC
L 0.28 0.35 0.42
H E 1.80
1.90
2.00
q 5° NOM
MIN
0.039
0.010
0.004
0.116
0.061
0.011
0.071
INCHES
NOM
0.041
0.012
0.006
0.120
0.065
0.025 BSC
0.022 BSC
0.014
0.075
5° NOM
MAX
0.043
0.014
0.008
0.122
0.067
0.017
0.079
0.457
0.018
2.032
0.08
SOLDERING FOOTPRINT*
0.635
0.025
2.032
0.08
1.727
0.068
0.66
0.026
0.711
0.028
ǒ ǓSCALE 20:1
mm
inches
0.457
0.018
0.66
0.026
0.711
0.028
0.178
0.007
ǒ ǓSCALE 20:1
mm
inches
Basic
Style 4
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ChipFET is a trademark of Vishay Siliconix.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
5
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NSS20600CF8/D
5 Page | ||
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| PDF Descargar | [ Datasheet NSS20600CF8T1G.PDF ] | |
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