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PDF NUF2222FC Data sheet ( Hoja de datos )
| Número de pieza | NUF2222FC | |
| Descripción | 2 Line USB 1.1 Upstream EMI Filter | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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NUF2222FC
2 Line USB 1.1 Upstream
EMI Filter
This device is a 2 line EMI filter array for USB port protection in
wireless applications. Greater than −20 dB attenuation is obtained at
frequencies from 900 MHz to 3.0 GHz. It also has 2 lines for dedicated
ESD protection. ESD protection is provided across all capacitors.
Features
• EMI Filtering and ESD Protection
• Integration of 10 Discretes
• Provides Protection for IEC61000−4−2 (Level 4)
♦ 15 kV (Contact)
• Flip−Chip Package
• Moisture Sensitivity Level 1
• ESD Rating: Machine Model = C; Human Body Model = 3B
Benefits
• Reduces EMI/RFI Emissions on a Data Line
• Integrated Solution Offers Cost and Space Savings
• Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass
Filter Response
• Integrated Solution Improves System Reliability
• This is a Pb−Free Device
Applications
• EMI Filtering and ESD Protection for Data Lines
• Cell Phones
• Handheld Products
• Notebook Computers
• MP3 Players
http://onsemi.com
A3
A1 1.3 K
33 R
C1
B2
C3
D2
(Gnd Pin)
33 R
E1 E3
1
Flip−Chip
FC SUFFIX
CASE 499AM
MARKING
DIAGRAM
1
2222AYWW
2222
A
Y
WW
= Specific Device Code
= Assembly Location
= Year
= Work Week
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating
Symbol Value
Unit
ESD Discharge
IEC61000−4−2
Contact Discharge
VPP
15 kV
Operating Temperature Range
TOP −40 to +85 °C
Storage Temperature Range
TSTG −55 to +150 °C
Junction Temperature
TJ
+125
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
PIN CONFIGURATION
3 21
A
B
C
D
E
ORDERING INFORMATION
Device
Package
Shipping†
NUF2222FCT1G Flip−Chip 3000 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2005
June, 2005 − Rev. 0
1
Publication Order Number:
NUF2222FC/D
1 page  
NUF2222FC
PACKAGE DIMENSIONS
4X
0.10 C
TERMINAL A1
LOCATOR
8 PIN FLIP−CHIP
CASE 499AM−01
ISSUE O
D AB
E
0.10 C
TOP VIEW
A2
A1
A
C
0.05 C
SIDE VIEW
SEATING
PLANE
e
e/2
8X b
0.05 C A B
0.03 C
E
D
C
B
A
123
E1
e
e/2
BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM MIN MAX
A −−− 0.700
A1 0.210 0.270
A2 0.380 0.430
D 1.270 BSC
E 1.970 BSC
b 0.290 0.340
e 0.700 BSC
E1 1.400 BSC
http://onsemi.com
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet NUF2222FC.PDF ] | |
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