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PDF NTTD1P02R2 Data sheet ( Hoja de datos )

Número de pieza NTTD1P02R2
Descripción Power MOSFET ( Transistor )
Fabricantes ON Semiconductor 
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NTTD1P02R2
Power MOSFET
−1.45 Amps, −20 Volts
P−Channel Enhancement Mode
Dual Micro8 Package
Features
Ultra Low RDS(on)
Higher Efficiency Extending Battery Life
Logic Level Gate Drive
Miniature Dual Micro8 Surface Mount Package
Diode Exhibits High Speed, Soft Recovery
Micro8 Mounting Information Provided
Applications
Power Management in Portable and Battery−Powered Products, i.e.:
Computers, Printers, PCMCIA Cards, Cellular and Cordless
Telephones
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Thermal Resistance −
Junction−to−Ambient (Note 1.)
Total Power Dissipation @ TA = 25°C
Continuous Drain Current @ TA = 25°C
Continuous Drain Current @ TA = 70°C
Pulsed Drain Current (Note 3.)
Thermal Resistance −
Junction−to−Ambient (Note 2.)
Total Power Dissipation @ TA = 25°C
Continuous Drain Current @ TA = 25°C
Continuous Drain Current @ TA = 70°C
Pulsed Drain Current (Note 3.)
Operating and Storage
Temperature Range
VDSS
VGS
RθJA
PD
ID
ID
IDM
RθJA
PD
ID
ID
IDM
TJ, Tstg
−20
"8.0
V
V
250
0.50
−1.45
−1.15
−10
°C/W
W
A
A
A
125
1.0
−2.04
−1.64
−16
−55 to
+150
°C/W
W
A
A
A
°C
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C
(VDD = −20 Vdc, VGS = −4.5 Vdc,
Peak IL = −3.5 Apk, L = 5.6 mH,
RG = 25 )
Maximum Lead Temperature for Soldering
Purposes for 10 seconds
EAS
TL
35 mJ
260 °C
1. Minimum FR−4 or G−10 PCB, Steady State.
2. Mounted onto a 2square FR−4 Board (1sq. 2 oz Cu 0.06thick single
sided), Steady State.
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2%.
http://onsemi.com
−1.45 AMPERES
−20 VOLTS
160 mW @ VGS = −4.5
Dual P−Channel
D
G
S
8
1
Micro8
CASE 846A
STYLE 2
MARKING DIAGRAM
& PIN ASSIGNMENT
Source 1
Gate 1
Source 2
Gate 2
18
2
3
4
YWW
BC
7
6
5
Drain 1
Drain 1
Drain 2
Drain 2
(Top View)
Y = Year
WW = Work Week
BC = Device Code
ORDERING INFORMATION
Device
Package
Shipping
NTTD1P02R2 Micro8 4000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2003
December, 2003 − Rev. 1
1
Publication Order Number:
NTTD1P02R2/D

1 page




NTTD1P02R2 pdf
NTTD1P02R2
TYPICAL ELECTRICAL CHARACTERISTICS
1000
D = 0.5
100
0.2
0.1
0.05
10
0.02
0.01
1
SINGLE PULSE
0.1
1.0E−05 1.0E−04
P(pk)
t1
t2
DUTY CYCLE, D = t1/t2
RθJC(t) = r(t) RθJC
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) − TC = P(pk) RθJC(t)
1.0E−03
1.0E−02
1.0E−01
t, TIME (s)
1.0E+00
Figure 13. Thermal Response
1.0E+01 1.0E+02 1.0E+03
http://onsemi.com
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