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PDF NTGD1100L Data sheet ( Hoja de datos )
| Número de pieza | NTGD1100L | |
| Descripción | Power MOSFET ( Transistor ) | |
| Fabricantes | ON Semiconductor | |
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NTGD1100L
Power MOSFET
8 V, ±3.3 A, Load Switch with Level−Shift,
P−Channel, TSOP−6
The NTGD1100L integrates a P and N−Channel MOSFET in a
single package. This device is particularly suited for portable
electronic equipment where low control signals, low battery voltages
and high load currents are needed. The P−Channel device is
specifically designed as a load switch using ON Semiconductor
state−of−the−arttrench technology. The N−Channel, with an external
resistor (R1), functions as a level−shift to drive the P−Channel. The
N−Channel MOSFET has internal ESD protection and can be driven
by logic signals as low as 1.5 V. The NTGD1100L operates on supply
lines from 1.8 to 8.0 V and can drive loads up to 3.3 A with 8.0 V
applied to both VIN and VON/OFF
Features
• Extremely Low RDS(on) Load Switch MOSFET
• Level Shift MOSFET is ESD Protected
• Low Profile, Small Footprint Package
• VIN Range 1.8 to 8.0 V
• ON/OFF Range 1.5 to 8.0 V
• ESD Rating of 3000 V
• Pb−Free Package is Available
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) www.DataSheet4U.com
Rating
Symbol Value Unit
Input Voltage (VDSS, P−Ch)
ON/OFF Voltage (VGS, N−Ch)
Continuous Load Current Steady
(Note 1)
State
Power Dissipation
(Note 1)
Steady
State
TA = 25°C
TA = 85°C
TA = 25°C
TA = 85°C
Pulsed Load Current
tp = 10 ms
Operating Junction and Storage Temperature
VIN
VON/OFF
IL
PD
ILM
TJ,
TSTG
8.0
8.0
±3.3
±2.4
0.83
0.43
±10
−55 to
150
V
V
A
W
A
°C
Source Current (Body Diode)
ESD Rating, MIL−STD−883D HBM
(100 pF, 1.5 kW)
IS
ESD
−1.0 A
3.0 kV
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
TL 260 °C
THERMAL RESISTANCE RATINGS
Rating
Symbol Max Unit
Junction−to−Ambient – Steady State (Note 1) RmJA
150 °C/W
Junction−to−Foot – Steady State (Note 1)
RmJF
50
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
© Semiconductor Components Industries, LLC, 2007
March, 2007 − Rev. 6
1
http://onsemi.com
V(BR)DSS
8.0 V
RDS(on) TYP
40 mW @ −4.5 V
55 mW @ −2.5 V
80 mW @ −1.8 V
ID MAX
±3.3 A
SIMPLIFIED SCHEMATIC
4 2,3
Q2
6
5 Q1
1
1
TSOP−6
CASE 318G
STYLE 11
MARKING DIAGRAM &
PIN ASSIGNMENT
D1/G2 G1 S2
654
TZ M G
G
1 23
S1 D2 D2
TZ = Specific Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping†
NTGD1100LT1
TSOP−6 3000/Tape & Reel
NTGD1100LT1G
TSOP−6
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
NTGD1100L/D
1 page  
NTGD1100L
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE P
D
65 4
HE
12 3
E
b
e
0.05 (0.002)
A1
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
q
c
L
MILLIMETERS
DIM MIN
NOM MAX
A 0.90
1.00
1.10
A1 0.01
0.06
0.10
b 0.25 0.38 0.50
c 0.10 0.18 0.26
D 2.90
3.00
3.10
E 1.30
1.50
1.70
e 0.85 0.95 1.05
L 0.20 0.40 0.60
H E 2.50
q 0°
2.75
−
3.00
10°
STYLE 11:
PIN 1. SOURCE 1
2. DRAIN 2
3. DRAIN 2
4. SOURCE 2
5. GATE 1
6. DRAIN 1/GATE 2
MIN
0.035
0.001
0.010
0.004
0.114
0.051
0.034
0.008
0.099
0°
INCHES
NOM
0.039
0.002
0.014
0.007
0.118
0.059
0.037
0.016
0.108
−
MAX
0.043
0.004
0.020
0.010
0.122
0.067
0.041
0.024
0.118
10°
SOLDERING FOOTPRINT*
2.4
0.094
1.9
0.075
0.95
0.037
0.95
0.037
0.7
0.028
1.0
0.039
ǒ ǓSCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer
purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
http://onsemi.com
5
NTGD1100L/D
5 Page | ||
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| PDF Descargar | [ Datasheet NTGD1100L.PDF ] | |
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