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NCP5010 PDF даташит

Спецификация NCP5010 изготовлена ​​​​«ON Semiconductor» и имеет функцию, называемую «Boost Converter».

Детали детали

Номер произв NCP5010
Описание Boost Converter
Производители ON Semiconductor
логотип ON Semiconductor логотип 

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NCP5010 Даташит, Описание, Даташиты
NCP5010
500 mW Boost Converter for
White LEDs
The NCP5010 is a fixed frequency PWM boost converter with
integrated rectification optimized for constant current applications
such as driving white LEDs. This device features small size, minimal
external components and high−efficiency for use in portable
applications and is capable of providing up to 500 mW output power
to 2−5 series connected white LEDs. A single resistor sets the LED
current and the CTRL pin can be pulse width modulated (PWM) to
reduce the LED Current.
The device includes True−Cutoff circuitry to disconnect the load
from the battery when the device is put into standby mode. To protect
the device, an output overvoltage protection, and short circuit
protection have been incorporated. The NCP5010 is housed in a low
profile, space efficient 1.7 x 1.7 mm Flip−Chip package. The device
has been optimized for use with small inductors and ceramic
capacitors.
Features
http://onsemi.com
MARKING
DIAGRAM
A1
8−Pin Flip−Chip
FC SUFFIX
1 CASE 499AJ
DAXG
AYWW
DAX
G
A
Y
WW
= Specific Device Code
= Pb−Free Package
= Assembly Location
= Year
= Work Week
2.7 to 5.5 V Input Voltage Range
Efficiency: 84% for 5 LED (VF = 3.5 V by LED) at 30 mA and
4.2 V VIN
Low Noise 1 MHz PWM DC−DC Converter
Open LED Protection and Short Circuit Protection www.DataSheet4U.com
Serial LEDs Architecture for Uniform Current Matching
1 mA Shutdown Current Facility with True−Cutoff
Very Small 8−Pin Flip−Chip 1.7 x 1.7 mm Package
This is a Pb−Free Device
PIN CONNECTIONS
A1 A2 A3
AGND CTRL NC
B1 B3
VIN FB
C1 C2 C3
VOUT SW PGND
Typical Applications
Top View
White LED Backlighting for Small Color LCD Displays
Cellular Phones
Digital Cameras
MP3 Players
High Efficiency Step−up Converter
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 16 of this data sheet.
90
80 VOUT = 5 LED (18 V)
70 VOUT = 3 LED (11 V)
60
50
40
30
20
10
VIN = 4.2 V
0
1 10 100
IOUT (mA)
Figure 1. Efficiency vs. Output Current
© Semiconductor Components Industries, LLC, 2006
August, 2006 − Rev. 1
1
Publication Order Number:
NCP5010/D









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NCP5010 Даташит, Описание, Даташиты
NCP5010
Vbat
2.7 to 5.5 V
Cin
4.7 mF 0603
X5R 6.3V
L1
22 mH
LED
ENABLE
A2
CTRL
A3
NC
NCP5010
VOUT C1
Cout
1 mF 0805
X5R 25V
LED
Rfb
24
Figure 2. Typical Application Circuit
PIN FUNCTION DESCRIPTION
PIN PIN NAME TYPE
A1 AGND POWER
B1 VIN POWER
C1
VOUT
POWER
A2
CTRL
INPUT
C2 SW POWER
A3 NC N/A
B3 FB INPUT
C3 PGND POWER
DESCRIPTION
System ground for the analog circuitry. A high quality ground must be provided to avoid spikes and/
or uncontrolled operations. This pin is to be connected to the PGND pin.
Power Supply Input. A ceramic capacitor with a minimum value of 1 mF/6.3 V (X5R or X7R) must be
connected to this pin. This capacitor should be placed as close as possible to this pin. In addition,
one end of the external inductor is to be connected at this point.
DC−DC converter output. This pin should be directly connected to the load and a low ESR
(<30 mW) 1 mF (min) 25 V bypass capacitor. This capacitor is required to smooth the current flowing
into the load, thus limiting the noise created by the fast transients present in this circuit. Since this is
a current regulated output, this pin has over voltage protection to protect from open load conditions.
Care must be taken to avoid EMI through the PCB copper tracks connected to this pin.
An Active High logic level on this pin enables the device. A built−in pulldown resistor disables the
device if the pin is left open. This pin can also be used to control the average current into the load
by applying a low frequency PWM signal. If a PWM signal is applied, the frequency should be high
enough to avoid optical flicker but be no greater than 1 kHz.
Power switch connection for inductor. Typical application will use a coil from 10 mH to 22 mH and
must be able to handle at least 350 mA. If the desired output power is above 300 mW, the inductor
should have a DCR < 1.4 W.
Not Connected
Feedback voltage input used to close the loop by means of a sense resistor connected between the
primary LED branch and the ground. The output current tolerance is depends upon the accuracy of
this resistor and a ±5% or better accuracy metal film resistor is recommended. An analog dimming
signal can be applied to this point to reduce the output current. Please refer to the application
section for additional details.
Power ground. A high quality ground must be used to avoid spikes and/or uncontrolled operation.
Care must be taken to avoid high−density current flow in a limited PCB copper track. This pin is to
be connected to the AGND pin.
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NCP5010 Даташит, Описание, Даташиты
NCP5010
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Power Supply Voltage (Note 2)
Over Voltage Protection
Human Body Model (HBM) ESD Rating (Note 3)
VIN
VOUT
ESD HBM
7.0
24
2000
V
V
V
Machine Model (MM) ESD Rating (Note 3)
ESD MM
200
V
Digital Input Voltage
Digital Input Current
CTRL
−0.3 < VIN < Vbat+0.3
1.0
V
mA
Power Dissipation @ TA = +85 °C
Thermal Resistance Junction−to−Air
8−Pin Flip−Chip Package
PD
RqJA
150
(Note 6)
mW
°C/W
Operating Ambient Temperature Range
TA
−40 to +85
°C
Operating Junction Temperature Range
TJ
−40 to +125
°C
Storage Temperature Range
Tstg
−65 to +150
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values
(not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage
may occur and reliability may be affected.
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = 25°C.
2. According to JEDEC standard JESD22−A108B.
3. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115 for all pins.
4. Latchup Current Maximum Rating: ±100 mA per JEDEC standard: JESD78.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.
6. For the 8−Pin Flip−Chip CSP Package, the RqJA is highly dependent on the PCB Heatsink area. For example RqJA can be to 195°C/W with
50 mm total area and also 135°C/W with 500 mm. All the bumps have the same thermal resistance and need to be connected thereby optimizing
the power dissipation.
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NCP5010Boost ConverterON Semiconductor
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