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PDF NL27WZ86 Data sheet ( Hoja de datos )
| Número de pieza | NL27WZ86 | |
| Descripción | Dual 2-Input Exclusive-OR Gate | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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NL27WZ86
Dual 2−Input Exclusive−OR
Gate
The NL27WZ86 is a high performance dual 2−input Exclusive−OR
Gate operating from a 1.65 V to 5.5 V supply.
Features
• Extremely High Speed: tPD 2.4 ns (typical) at VCC = 5.0 V
• Designed for 1.65 V to 5.5 V VCC Operation
• Over Voltage Tolerant Inputs and Outputs
• LVTTL Compatible − Interface Capability With 5.0 V TTL Logic
with VCC = 3.0 V
• LVCMOS Compatible
• 24 mA Balanced Output Sink and Source Capability
• Near Zero Static Supply Current Substantially Reduces System
Power Requirements
• Replacement for NC7WZ86
• Pb−Free Package is Available
A1 1
B1 2
Y2 3
GND 4
8 VCC
7 Y1
6 B2
5 A2
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Figure 1. Pinout (Top View)
PIN ASSIGNMENT
Pin Function
1 A1
2 B1
3 Y2
4 GND
5 A2
6 B2
7 Y1
8 VCC
http://onsemi.com
8
1
US8
US SUFFIX
CASE 493
MARKING
DIAGRAM
8
L8 M G
G
1
L8 = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
A1
B1
= 1 Y1
A2
B2
Y2
Figure 2. Logic Symbol
FUNCTION TABLE
Input
AB
LL
LH
HL
HH
Output
Y=A+B
Y
L
H
H
L
© Semiconductor Components Industries, LLC, 2005
September, 2005 − Rev. 3
1
Publication Order Number:
NL27WZ86/D
1 page  
NL27WZ86
−X−
A
8 5 −Y−
BL
14
PG
−T−
SEATING
PLANE
C
DK
0.10 (0.004) M T X Y
PACKAGE DIMENSIONS
US8
US SUFFIX
CASE 493−02
ISSUE A
J
DETAIL E
R
S
U
0.10 (0.004) T
V
H
N
DETAIL E
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR.
MOLD FLASH. PROTRUSION AND GATE
BURR SHALL NOT EXCEED 0.140 MM
(0.0055”) PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE
INTER−LEAD FLASH OR PROTRUSION.
INTER−LEAD FLASH AND PROTRUSION
SHALL NOT E3XCEED 0.140 (0.0055”) PER
SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076−0.0203 MM.
(300−800 “).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED ±0.0508 (0.0002 “).
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 1.90 2.10 0.075 0.083
B 2.20 2.40 0.087 0.094
C 0.60 0.90 0.024 0.035
D 0.17 0.25 0.007 0.010
F 0.20 0.35 0.008 0.014
R 0.10 TYP
G
H
0.50 BSC
0.40 REF
0.020 BSC
0.016 REF
J 0.10 0.18 0.004 0.007
K 0.00 0.10 0.000 0.004
M
L 3.00 3.20 0.118 0.126
M 0_ 6_ 0_ 6_
N 5 _ 10 _ 5 _ 10 _
P 0.23 0.34 0.010 0.013
R 0.23 0.33 0.009 0.013
S 0.37 0.47 0.015 0.019
U 0.60 0.80 0.024 0.031
V 0.12 BSC
0.005 BSC
SOLDERING FOOTPRINT*
3.8
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ0.5TYP
1.8 TYP
0.3 TYP
1.0 (mm)
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet NL27WZ86.PDF ] | |
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