HI1109 PDF даташит
Спецификация HI1109 изготовлена «Hi-Sincerity Mocroelectronics» и имеет функцию, называемую «PNP EPITAXIAL PLANAR TRANSISTOR». |
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Детали детали
Номер произв | HI1109 |
Описание | PNP EPITAXIAL PLANAR TRANSISTOR |
Производители | Hi-Sincerity Mocroelectronics |
логотип |
3 Pages
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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE9019-B
Issued Date : 1996.04.15
Revised Date : 2000.11.01
Page No. : 1/3
HI1109
PNP EPITAXIAL PLANAR TRANSISTOR
Description
• Low frequency high voltage amplifier
• Complementary pair with HI1609
Absolute Maximum Ratings (Ta=25°C)
• Maximum Temperatures
Storage Temperature ............................................................................................. -55~+150 °C
Junction Temperature .................................................................................................... +150 °C
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ................................................................................. 1.25 W
• Maximum Voltages and Currents
BVCBO Collector to Base Voltage ................................................................................... -160 V
BVCEO Collector to Emitter Voltage................................................................................ -160 V
BVEBO Emitter to Base Voltage .......................................................................................... -5 V
IC Collector Current ..................................................................................................... -100 mA
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Characteristics (Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
*VCE(sat)
VBE
*hFE1
*hFE2
fT
Cob
Min.
-160
-160
-5
-
-
-
60
30
-
-
Typ.
-
-
-
-
-
-
-
-
140
5.5
Classification Of hFE1
Max.
-
-
-
-10
-2
-1.5
320
-
-
-
Unit Test Conditions
V
V
V
uA
V
V
MHz
pF
IC=-10uA, IE=0
IC=-1mA, IB=0
IE=-10uA, IC=0
VCB=-140V, IE=0
IC=-30mA, IB=-3mA
VCE=-5V, IC=-10mA
VCE=-5V, IC=-10mA
VCE=-5V, IC=-1mA
VCE=-5V, IC=-10mA
VCB=-10V, f=-1MHz
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
Rank
Range
B
60-120
C
100-200
D
160-320
HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE9019-B
Issued Date : 1996.04.15
Revised Date : 2000.11.01
Page No. : 2/3
Current Gain & Collector Current
1000
Saturation Voltage & Collector Current
1000
VCE=5V
100 100
VCE(sat) @ IC=10IB
10
0.1
10000
1 10
Collector Current (mA)
100
On Voltage & Collector Current
10
0.1
1 10
Collector Current (mA)
100
Capacitance & Reverse-Biased Voltage
100
1000
VBE(on) @ VCE=5V
100
0.1
1 10
Collector Current (mA)
100
Cutoff Frequency & Collector Current
1000
10
1
0.1
Cob
1 10
Reverse Biased Voltage (V)
100
fT @ VCE=5V
100
10
1
10 100
Collector Current (mA)
1000
HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
TO-251 Dimension
Spec. No. : HE9019-B
Issued Date : 1996.04.15
Revised Date : 2000.11.01
Page No. : 3/3
A BC
F
3
EK
2
G
I
Marking :
HSMC Logo
Product Series
D Part Number
Date Code
Rank
Ink Mark
Style : Pin 1.Base 2.Collector 3.Emitter
H
1
J
3-Lead TO-251 Plastic Package
HSMC Package Code : I
DIM
Inches
Min. Max.
A 0.0177 0.0217
B 0.0354 0.0591
C 0.0177 0.0236
D 0.0866 0.0945
E 0.2520 0.2677
F 0.2677 0.2835
Millimeters
Min. Max.
0.45 0.55
0.90 1.50
0.45 0.60
2.20 2.40
6.40 6.80
6.80 7.20
DIM
Inches
Min. Max.
G 0.2559
-
H - *0.1811
I - 0.0354
J - 0.0315
K 0.2047 0.2165
*:Typical
Millimeters
Min. Max.
6.50
-
- *4.60
- 0.90
- 0.80
5.20 5.50
Notes : 1.Dimension and tolerance based on our Spec. dated May. 24,1995.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
• Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
• Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
• Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
HSMC Product Specification
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