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PDF HBN2411S6R Data sheet ( Hoja de datos )
| Número de pieza | HBN2411S6R | |
| Descripción | General Purpose NPN Epitaxial Planar Transistors | |
| Fabricantes | Cystech Electonics | |
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CYStech Electronics Corp.
General Purpose NPN Epitaxial Planar Transistors
(dual transistors)
HBN2411S6R
Spec. No. : C203S6R
Issued Date : 2003.09.12
Revised Date : 2005.03.30
Page No. : 1/ 5
Features
• Two BTC2411chips in a SOT-363 package.
• Mounting possible with SOT-323 automatic mounting machines.
• Transistor elements are independent, eliminating interference.
• Mounting cost and area can be cut in half.
• High IC(Max) . IC (Max) = 0.6A
• Low VCE(sat) , TYP. VCE(sat) = 0.2V at IC/IB = 500mA/50mA
Optimal for low Voltage operation
• Complementary to HBP1036S6R
Equivalent Circuit
Outline
HBN2411S6R
SOT-363R
Tr1 Tr2
The following characteristics apply to both Tr1 and Tr2
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Power Dissipation
Junction Temperature
Storage Temperature
Symbol
VCBO
VCEO
VEBO
IC
Pd
Tj
Tstg
Limits
60
40
6
0.6
200(total)
150
-55~+150
(Note)
Note : 150mW per element must not be exceeded.
Unit
V
V
V
A
mW
°C
°C
HBN2411S6R
CYStek Product Specification
1 page  
CYStech Electronics Corp.
SOT-363R Dimension
Spec. No. : C202S6R
Issued Date : 2003.06.11
Revised Date : 2004.11.04
Page No. : 5/5
Style:
Pin 1. Emitter1 (E1)
Pin 2. Base1 (B1)
Pin 3. Collector2 (C2)
Pin 4. Emitter2 (E2)
Pin 5. Base2 (B2)
Pin 6. Collector1 (C1)
Marking:
1P
6-Lead SOT-363R Plastic
Surface Mounted Package
CYStek Package Code: S6R
DIM
Inches
Min. Max.
A 0.071 0.087
B 0.045 0.053
C 0.031 0.043
D 0.004 0.012
G 0.026BSC
H - 0.004
Millimeters
Min. Max.
DIM
Inches
Min. Max.
1.8 2.2 J 0.004 0.010
1.15 1.35
K 0.004 0.012
0.8 1.1 N
0.008 REF
0.1 0.3 S 0.079 0.087
0.65BSC
Y 0.012 0.016
- 0.1
*:Typical
Millimeters
Min. Max.
0.1 0.25
0.1 0.30
0.20 REF
2.00 2.40
0.30 0.40
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
HBN2412S6R
CYStek Product Specification
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet HBN2411S6R.PDF ] | |
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