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PDF HMC648 Data sheet ( Hoja de datos )
| Número de pieza | HMC648 | |
| Descripción | GaAs MMIC 6-BIT DIGITAL PHASE SHIFTER | |
| Fabricantes | Hittite Microwave | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de HMC648 (archivo pdf) en la parte inferior de esta página. Total 8 Páginas | ||
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v00.0607
Typical Applications
The HMC648 is ideal for:
• EW Receivers
5 • Weather & Military Radar
• Satellite Communications
• Beamforming Modules
• Phase Cancellation
Functional Diagram
HMC648
GaAs MMIC 6-BIT DIGITAL
PHASE SHIFTER, 2.9 - 3.9 GHz
Features
Low RMS Phase Error: 1.5°
Low Insertion Loss: 4 dB
High Linearity: +45 dBm
Positive Control Voltage
360° Coverage, LSB = 5.625°
Die Size: 3.85 x 1.85 x 0.1 mm
General Description
The HMC648 is a 6-bit digital phase shifter
die which is rated from 2.9 to 3.9 GHz, providing
360 degrees of phase coverage, with a LSB of 5.625
degrees. The HMC648 features very low RMS phase
error of 1.5 degrees and extremely low insertion loss
variation of ±0.5 dB across all phase states. This
high accuracy phase shifter is controlled with positive
control logic of 0/+5V, and is internally matched to 50
Ohms with no external components.
5 - 56
Electrical Specifications, TA = +25° C,
Vss= -5V, Vdd= +5V, Control Voltage = 0/+5V, 50 Ohm System
Parameter
Frequency Range
Insertion Loss*
Input Return Loss*
Output Return Loss*
Phase Error*
RMS Phase Error
Insertion Loss Variation*
Input Power for 1 dB Compression
Input Third Order Intercept
Control Voltage Current
Bias Control Current
*Note: Major States Shown
Min.
2.9
Typ.
4
16
14
±5
1.5
±0.5
31
45
<250
<12
Max.
3.9
6
+10 / -18
Units
GHz
dB
dB
dB
deg
deg
dB
dBm
dBm
μA
mA
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
1 page  
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v00.0607
Outline Drawing
5
HMC648
GaAs MMIC 6-BIT DIGITAL
PHASE SHIFTER, 2.9 - 3.9 GHz
Die Packaging Information [1]
Standard
Alternate
GP-1
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS IN INCHES (MILLIMETERS)
2. DIE THICKNESS IS 0.004
3. BACKSIDE METALLIZATION: GOLD
4. BACKSIDE METAL IS GROUND
5. BOND PADS METALLIZATION: GOLD
6. OVERALL DIE SIZE ±0.002
5 - 60
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet HMC648.PDF ] | |
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