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HEDS-9000 PDF даташит

Спецификация HEDS-9000 изготовлена ​​​​«AVAGO TECHNOLOGIES» и имеет функцию, называемую «Optical Encoder Modules Reliability Data».

Детали детали

Номер произв HEDS-9000
Описание Optical Encoder Modules Reliability Data
Производители AVAGO TECHNOLOGIES
логотип AVAGO TECHNOLOGIES логотип 

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HEDS-9000 Даташит, Описание, Даташиты
www.DaHtaESDheSe-t54U5.0co0m, HEDS-6500 and HEDS-9000, 9100, 9200 Series
Motion Sensing Products, Optical Encoder Modules
Reliability Data
Description
The following cumulative test results have been obtained
from testing performed at Avago Technologies in accord-
ance with the latest revision of MIL- STD-883.
Avago tests parts at the absolute maximum rated con-
ditions recommended for the device. The actual per-
formance you obtain from Avago parts depends on the
electrical and environmental characteristics of your ap-
plication but will probably be better than the perform-
ance outlined in Table 1.
Table 1. Life Tests
Demonstrated Performance
Failure Rate Prediction
The failure rate of semiconductor devices is determined
by the junction temperature of the device. The relation-
ship between ambient temperature and actual junction
temperature is given by the following:
TJ (°C) = TA (°C) + θJA PAVG
where
TA = ambient temperature in °C
θjuJAn=cttiohne-rtmoa-al mrebsiisetnatnicne°oCf/watt
PAVG = average power dissipated in watts
The estimated MTBF and failure rate at temperatures
lower than the actual stress temperature can be deter-
mined by using an Arrhenius model for temperature ac-
celeration. Results of such calculations are shown in the
table on the following page using an activation energy of
0.43 eV (reference MIL-HDBK-217).
Test Name
High Temperature
Operating Life
Temperature
Humidity
Operating Life
Stress Test
Conditions
VVT1AA0CC=0==01V5h0B.o0=5°uVC3r,s.5 V
VV1A,C0C=0=0V5Bh.=5ouV3r.s5 V
TRAH==8855°C%
Total
Device Hrs.
1,405,000
Units
Tested
1,405
1,495,000
1,495
Total
Failed
2
10
Point Typical Performance
Failure Rate
MTBF (% /1K Hours)
702,500
0.142
149,500
0.669










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HEDS-9000 Даташит, Описание, Даташиты
Table 2.
Ambient
Temperature (°C)
+100
+90
+80
+70
+60
+50
+40
+30
+20
Junction
Temperature (°C)
+110
+100
+90
+80
+70
+60
+50
+40
+30
Point Typical Performance [1]
in Time
MTBF [1]
Failure Rate
(%/1K Hours)
703,000
0.142
996,000
0.100
1,440,000
0.069
2,126,000
0.047
3,210,000
0.031
4,968,000
0.020
7,901,000
0.013
12,942,000
0.008
21,903,000
0.005
Performance in Time [2]
(90% Confidence)
MTBF [2]
Failure Rate
(%/1K Hours)
264,000
0.379
374,000
0.267
541,000
0.185
799,000
0.125
1,206,000
0.083
1,867,000
0.054
2,969,000
0.034
4,863,000
0.021
8,230,000
0.012
Notes:
1. The point typical MTBF (which represents 60% confidence level) is the total device hours divided by the number of failures. In the case of zero
failures, one failure is assumed for this calculation.
2. The 90% Confidence MTBF represents the minimum level of reliability performance which is expected from 90% of all samples. This confidence
interval is based on the statistics of the distribution of failures. The assumed distribution of failures is exponential. This particular distribution is
commonly used in describing useful life failures. Refer to MIL-STD-690B for details on this methodology.
3. Failures are catastrophic or parametric. Catastrophic failures are open, short, no logic output, no dynamic parameters while parametric failures
are failures to meet an electrical characteristic as specified in product catalog such as output voltage, duty or state errors.
Example of Failure Rate Calculation
Assume a device operating 8 hours/day, 5 days/week. The utilization factor, given 168 hours/week is:
(8 hours/day) x (5 days/week) / (168 hours/week) = 0.25
The point failure rate per year (8760 hours) at 50°C ambient temperature is:
(0.020% / 1K hours) x 0.25 x (8760 hours/year) = 0.044% per year
Similarly, 90% confidence level failure rate per year at 50°C:
(0.054% / 1K hours) x 0.25 x (8760 hours/year) = 0.118% per year










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HEDS-9000 Даташит, Описание, Даташиты
Table 3. Environmental Tests
Test Name
Temperature Cycle
MIL-STD-883C
Reference
1010
Solder Heat Resistance
High Temperature
Storage Life
2003
N/A
Test Conditions
-40°C to +100°C, 15 minute dwell,
5 minute transfer,
5 cycles
200 cycles
500 cycles
Sn/Pb 60/40 Solder; 260°C peak;
10 sec., 20 temp cycles @ -40°C to 85°C
TA = +105°C
2,000 hours
Units
Tested
9,512
1,570
1,570
38
77
Units
Failed
0
3
9
0
0
Table 4. Mechanical Tests
Test Name
Mechanical Shock
Vibration Variable Frequency
Terminal Strength
Lead Fatigue
MIL-STD-883C
Reference
2002
2007
2004 Condition A
2004, Cond. B
Test Conditions
5 blows; X, Y, Z axes, 1500 g, 0.5 msec.
3 cycles, 4 min. each X, Y, Z axes, 20 g min.
20 to 2000 Hz
5 to 1000 Hz
1 lb. for 30 seconds
3 bends, 15° minimum
Units
Tested
5
26
10
15
15
Units
Failed
0
0
0
0
0
Table 5. Electrical Tests
Test Name
ESD - Human Body Model
MIL-STD-883C
Reference
3015.2
Test Conditions
1.5 K, 100 pF, 5 positive and 5 negative dis-
charges per pin. VZ = 3.0 KV
Units
Tested
35
Units
Failed
0











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