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PDF NESB008AT Data sheet ( Hoja de datos )
| Número de pieza | NESB008AT | |
| Descripción | Specifications for Nichia Chip Type Blue LED | |
| Fabricantes | Nichia Chemical Industries | |
| Logotipo |  |
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No. STSE-CC6002A
<Cat.No.060113>
SPECIFICATIONS FOR NICHIA CHIP TYPE BLUE LED
MODEL : NESB008AT
NICHIA CORPORATION
-0-
1 page  
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Nichia STSE-CC6002A
<Cat.No.060113>
7.CAUTIONS
(1) Moisture Proof Package
· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.
There is a possibility that this can cause exfoliation of the contacts and damage to the optical
characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture
to a minimum in the package.
· The moisture proof package is made of an aluminum moisture proof bag with a zipper. A package of
a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag.
The silica gel changes its color from blue to pink as it absorbs moisture.
(2) Storage
· Storage Conditions
Before opening the package :
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a
year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel)
is recommended.
After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered
within 168 hours (7days) after opening the package. If unused LEDs remain, they should be
stored in moisture proof packages, such as sealed containers with packages of moisture absorbent
material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag
and to reseal the moisture proof bag again.
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage
time, baking treatment should be performed using the following conditions.
Baking treatment : more than 24 hours at 65 ± 5°C
· Nichia LED electrodes and leadframes are silver plated copper alloy. The silver surface may be
affected by environments which contain corrosive substances. Please avoid conditions which may
cause the LED to corrode, tarnish or discolor. This corrosion or discoloration might lower solderability
or might affect on optical characteristics.
· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
condensation can occur.
(3) Heat Generation
· Thermal design of the end product is of paramount importance. Please consider the heat generation
of the LED when making the system design. The coefficient of temperature increase per input
electric power is affected by the thermal resistance of the circuit board and density of LED placement
on the board, as well as other components. It is necessary to avoid intense heat generation and operate
within the maximum ratings given in this specification.
· The operating current should be decided after considering the ambient maximum temperature of LEDs.
-4-
5 Page 
2.4
Cathode mark
C 0.15
2.8
2.5
(2)
K
1.2
0.75
A
0.65
ITEM
PACKAGE
ENCAPSULATING RESIN
ELECTRODES
MATERIALS
Heat-Resistant Polymer
Silicone Resin (with Diffused)
Ag Plating Copper Alloy
Cathode
0.3
Anode
(NOTE) The LED may have flash/flange which exceeds
the tolerance of this print.
Model
NESB008A
Unit
mm
NICHIA CORPORATION Title
No.
OUTLINE DIMENSIONS 15/1
Scale
051104547011
Allow
±0.1
11 Page | ||
| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet NESB008AT.PDF ] | |
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