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PDF NTD3055-150 Data sheet ( Hoja de datos )
| Número de pieza | NTD3055-150 | |
| Descripción | Power MOSFET ( Transistor ) | |
| Fabricantes | ON Semiconductor | |
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NTD3055−150
Power MOSFET 9.0 A, 60 V
N−Channel DPAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
• Pb−Free Packages are Available
Typical Applications
• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value
Drain−to−Source Voltage
Drain−to−Gate Voltage (RGS = 10 MW)
Gate−to−Source Voltage
− Continuous
− Non−repetitive (tpv10 ms)
Drain Current
− Continuous @ TA = 25°C
− Continuous @ TA = 100°C
− Single Pulse (tpv10 ms)
Total Power Dissipation @ TA = 25°C
Derate above 25°C
Total Power Dissipation @ TA = 25°C (Note 1)
Total Power Dissipation @ TA = 25°C (Note 2)
Operating and Storage Temperature Range
VDSS
VDGR
VGS
VGS
ID
ID
IDM
PD
TJ, Tstg
60
60
"20
"30
9.0
3.0
27
28.8
0.19
2.1
1.5
−55 to
175
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C
(VDD = 25 Vdc, VGS = 10 Vdc,
L = 1.0 mH, IL(pk) = 7.75 A, VDS = 60 Vdc)
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
EAS
RqJC
RqJA
RqJA
30
5.2
71.4
100
Unit
Vdc
Vdc
Vdc
Adc
Apk
W
W/°C
W
W
°C
mJ
°C/W
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
TL 260 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. When surface mounted to an FR4 board using 0.5 sq in pad size.
2. When surface mounted to an FR4 board using minimum recommended
pad size.
http://onsemi.com
9.0 AMPERES, 60 VOLTS
RDS(on) = 122 mW (Typ)
N−Channel
D
G
S
12
3
1
2
3
MARKING
DIAGRAMS
4
Drain
4
DPAK
CASE 369C
STYLE 2
“SURFACE MOUNT”
1
Gate
2
Drain
3
Source
4
DPAK−3
CASE 369D
STYLE 2
“STRAIGHT LEAD”
4
Drain
12 3
Gate Drain Source
3150
A
Y
W
Device Code
= Assembly Location
= Year
= Work Week
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2004
August, 2004 − Rev. 4
1
Publication Order Number:
NTD3055−150/D
1 page  
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10
D = 0.5
0.2
1
0.1
0.05
0.01
SINGLE PULSE
0.1
0.00001
0.0001
NTD3055−150
0.001
0.01
t, TIME (s)
Figure 13. Thermal Response
P(pk)
t1
t2
DUTY CYCLE, D = t1/t2
0.1 1
10
ORDERING INFORMATION
Device
Package
Shipping†
NTD3055−150
DPAK
75 Units/Rail
NTD3055−150G
DPAK
(Pb−Free)
75 Units/Rail
NTD3055−150−1
DPAK−3
75 Units/Rail
NTD3055−150−1G
DPAK−3
(Pb−Free)
75 Units/Rail
NTD3055−150T4
DPAK
2500 Tape & Reel
NTD3055−150T4G
DPAK
(Pb−Free)
2500 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
5
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet NTD3055-150.PDF ] | |
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